Inventor · disambiguated record
Michael Friedemann
Also filed as: FRIEDEMANN MICHAEL
4 granted patents·2 pending applications·36 citations·filing 2003–2007
75Inventor score
Top patents by PatentIndex Score
6 records- 0180US7745327B2Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regimeADVANCED MICRO DEVICES INC·Filed 2007·Granted Jun 29, 2010·13 cites·18 claims
- 0277US7071096B2Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter depositionADVANCED MICRO DEVICES INC·Filed 2005·Granted Jul 4, 2006·6 cites·27 claims
- 0365US6841468B2Method of forming a conductive barrier layer having improve adhesion and resistivity characteristicsADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 11, 2005·11 cites·24 claims
- 0456US6984294B2Method of forming a conductive barrier layer having improved coverage within critical openingsADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 10, 2006·6 cites·17 claims
- 0535US2005093155A1Barrier layer including a titanium nitride liner for a copper metallization layer including a low-k dielectricFiled 2004·Application pending·0 cites
- 0633US2008206986A1Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regimePREUSSE AXEL·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Michael Friedemann files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →