Inventor · disambiguated record
Ayako Furuse
Also filed as: FURUSE AYAKO
3 granted patents·3 pending applications·1 citations·filing 2016–2024
52Inventor score
Files withDAINIPPON PRINTING CO LTD6
Top patents by PatentIndex Score
6 records- 0180US2024368361A1Polyimide film, method for producing polyimide film, and polyimide precursor resin compositionDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0271US2025031315A1Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0364US12144120B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·6 claims
- 0459US11191164B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2016·Granted Nov 30, 2021·1 cites·12 claims
- 0558US2019092913A1Polyimide film, method for producing polyimide film, and polyimide precursor resin compositionDAINIPPON PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 0646US11566108B2Polyimide film, laminate and surface material for displayDAINIPPON PRINTING CO LTD·Filed 2017·Granted Jan 31, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →