Inventor · disambiguated record
Takashi Habu
Also filed as: HABU TAKASHI
5 granted patents·11 pending applications·9 citations·filing 2008–2015
70Inventor score
Top patents by PatentIndex Score
16 records- 0184US10269477B2Soft magnetic resin composition and soft magnetic filmNITTO DENKO CORP·Filed 2014·Granted Apr 23, 2019·5 cites·3 claims
- 0276US10418161B2Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection deviceNITTO DENKO CORP·Filed 2014·Granted Sep 17, 2019·2 cites·6 claims
- 0370US9844147B2Method for producing soft magnetic film laminate circuit boardNITTO DENKO CORP·Filed 2014·Granted Dec 12, 2017·2 cites·2 claims
- 0456US2009010995A1Patch and patch preparationNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 0555US2016172086A1Soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminate circuit board, and position detection deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0654US2016083626A1Soft magnetic thermosetting adhesive film, magnetic film laminate circuit board, and position detection deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0752US2010028669A1Re-releasable adhesive agent and re-releasable adhesive sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0849US2016247612A1Soft magnetic resin composition and soft magnetic filmNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 0944US2011097576A1Re-peelable adhesive sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1035US8546958B2Pressure-sensitive adhesive sheet for protecting semiconductor waferHABU TAKASHI·Filed 2011·Granted Oct 1, 2013·0 cites·5 claims
- 1134US2012070661A1Pressure-sensitive adhesive tapeIKISHIMA SHINSUKE·Filed 2011·Application pending·0 cites
- 1234US2012058319A1Pressure-sensitive adhesive sheet for protecting semiconductor waferYAMAMOTO AKIYOSHI·Filed 2011·Application pending·0 cites
- 1334US2012070658A1Pressure-sensitive adhesive tapeIKISHIMA SHINSUKE·Filed 2011·Application pending·0 cites
- 1432US2017110231A1Soft magnetic resin composition and soft magnetic filmNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1531US8388786B2Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheetHABU TAKASHI·Filed 2010·Granted Mar 5, 2013·0 cites·1 claims
- 1629US2012065350A1Viscoelastic body and method for manufacturing the sameHABU TAKASHI·Filed 2011·Application pending·0 cites
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