Inventor · disambiguated record
Hiroshi Funakura
Also filed as: FUNAKURA HIROSHI
4 granted patents·56 citations·filing 2001–2004
75Inventor score
Technology areasH10W
Files withTOSHIBA KK4
Top patents by PatentIndex Score
4 records- 0184US6469373B2Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method thereforTOSHIBA KK·Filed 2001·Granted Oct 22, 2002·45 cites·49 claims
- 0249US7148529B2Semiconductor packageTOSHIBA KK·Filed 2002·Granted Dec 12, 2006·5 cites·11 claims
- 0349US6960494B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Nov 1, 2005·4 cites·5 claims
- 0443US6836012B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →