Inventor · disambiguated record
Kian Teng Eng
Also filed as: ENG KIAN TENG
18 granted patents·4 pending applications·866 citations·filing 1996–2017
96Inventor score
Files withTEXAS INSTRUMENTS INC12UNITED TEST & ASSEMBLY CT LTD3UTAC HEADQUARTERS PTE LTD2CASTILLO DENVER PAUL C1KOH YONG CHUAN1
Top patents by PatentIndex Score
22 records- 0195US5952611AFlexible pin location integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 14, 1999·216 cites·19 claims
- 0292US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 0390US8716873B2Semiconductor packages and methods of packaging semiconductor devicesWANG CHUEN KHIANG·Filed 2011·Granted May 6, 2014·19 cites·27 claims
- 0490US5956233AHigh density single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 21, 1999·132 cites·20 claims
- 0589US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 0688US9136142B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Sep 15, 2015·7 cites·24 claims
- 0784US5998860ADouble sided single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 7, 1999·82 cites·16 claims
- 0882US5798564AMultiple chip module apparatus having dual sided substrateTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 25, 1998·67 cites·6 claims
- 0980US6177723B1Integrated circuit package and flat plate molding process for integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jan 23, 2001·64 cites·9 claims
- 1079US9589875B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Mar 7, 2017·2 cites·20 claims
- 1179US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 1276US6514845B1Solder ball contact and methodTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 4, 2003·50 cites·8 claims
- 1372US6420782B1Vertical ball grid array integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Jul 16, 2002·21 cites·7 claims
- 1468US6084306ABridging method of interconnects for integrated circuit packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 4, 2000·37 cites·17 claims
- 1556US9881863B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jan 30, 2018·0 cites·20 claims
- 1644US2010102436A1Shrink package on boardUNITED TEST & ASSEMBLY CT LTD·Filed 2009·Application pending·0 cites
- 1737US8592258B2Semiconductor package and method of attaching semiconductor dies to substratesCASTILLO DENVER PAUL C·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 1837US2009165815A1Avoiding electrical shorts in packagingUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
- 1937US2009194871A1Semiconductor package and method of attaching semiconductor dies to substratesUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
- 2034US6320126B1Vertical ball grid array integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 20, 2001·6 cites·16 claims
- 2132US2009008796A1Copper on organic solderability preservative (osp) interconnectUNITED TEST & ASSEMBLY CT LTD·Filed 2007·Application pending·0 cites
- 2227US8247272B2Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding processKOH YONG CHUAN·Filed 2009·Granted Aug 21, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →