Inventor · disambiguated record
Michio Mashino
Also filed as: MASHINO MICHIO
19 granted patents·7 pending applications·267 citations·filing 2004–2015
95Inventor score
Top patents by PatentIndex Score
26 records- 0195US7875500B2Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting supportHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 25, 2011·25 cites·16 claims
- 0294US8617930B2Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2012·Granted Dec 31, 2013·19 cites·13 claims
- 0393US7968195B2Dicing tape laminated with adhesive sheet of polymer, epoxy resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·18 cites·15 claims
- 0493US7968194B2Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·19 cites·15 claims
- 0587US8470115B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 25, 2013·8 cites·3 claims
- 0687US8465615B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 18, 2013·8 cites·9 claims
- 0786USD656910SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·38 cites·1 claims
- 0883USD664512SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·27 cites·1 claims
- 0983USD656909SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Apr 3, 2012·28 cites·1 claims
- 1082USD664511SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2011·Granted Jul 31, 2012·26 cites·1 claims
- 1178US8017444B2Adhesive sheet, semiconductor device, and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Sep 13, 2011·8 cites·15 claims
- 1271USD680505SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Apr 23, 2013·15 cites·1 claims
- 1367USD690278SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 24, 2013·13 cites·1 claims
- 1465US9076832B2Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·1 cites·6 claims
- 1559USD689831SAdhesive tape for semiconductor manufacturingTANIGUCHI KOUHEI·Filed 2012·Granted Sep 17, 2013·9 cites·1 claims
- 1654US2013295314A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1754US2013302570A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1853US9190309B2Tape for processing wafer, method for manufacturing tape for processingHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 17, 2015·0 cites·5 claims
- 1952US9076833B2Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor deviceTANIGUCHI KOUHEI·Filed 2011·Granted Jul 7, 2015·0 cites·5 claims
- 2052US2008171187A1Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2008·Application pending·0 cites
- 2150US2012135176A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2012·Application pending·0 cites
- 2247US9969909B2Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductorYAMADA MASAKI·Filed 2008·Granted May 15, 2018·0 cites·22 claims
- 2346US2008261039A1Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor DeviceTANAKA MAIKO·Filed 2005·Application pending·0 cites
- 2445USD804435SFlap in an adhesive tape for semiconductor manufacturingHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 5, 2017·5 cites·1 claims
- 2543US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 2640US2006128065A1Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing methodINADA TEIICHI·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →