Inventor · disambiguated record
Arthur G. Merryman
Also filed as: MERRYMAN ARTHUR G · MERRYMAN ARTHUR GILMAN
17 granted patents·159 citations·filing 1995–2014
93Inventor score
Files withIBM17
Top patents by PatentIndex Score
17 records- 0173US5735452ABall grid array by partitioned lamination processIBM·Filed 1996·Granted Apr 7, 1998·38 cites·12 claims
- 0269US6427324B1Inherently robust repair process for thin film circuitry using UV laserIBM·Filed 1998·Granted Aug 6, 2002·33 cites·10 claims
- 0366US6099935AApparatus for providing solder interconnections to semiconductor and electronic packaging devicesIBM·Filed 1995·Granted Aug 8, 2000·24 cites·2 claims
- 0462US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 0551US6541709B1Inherently robust repair process for thin film circuitry using uv laserIBM·Filed 1996·Granted Apr 1, 2003·15 cites·5 claims
- 0649US9804498B2Filtering lead from photoresist stripping solutionIBM·Filed 2014·Granted Oct 31, 2017·0 cites·20 claims
- 0747US6455331B2Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 2001·Granted Sep 24, 2002·3 cites·3 claims
- 0846US7683493B2Intermetallic diffusion block device and method of manufactureIBM·Filed 2008·Granted Mar 23, 2010·0 cites·7 claims
- 0944US6916670B2Electronic package repair processIBM·Filed 2003·Granted Jul 12, 2005·1 cites·25 claims
- 1043US5722579ABottom-surface-metallurgy rework process in ceramic modulesIBM·Filed 1996·Granted Mar 3, 1998·13 cites·22 claims
- 1140US6149048AApparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1998·Granted Nov 21, 2000·7 cites·48 claims
- 1236US6448169B1Apparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1995·Granted Sep 10, 2002·5 cites·7 claims
- 1335US6048741ATop-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1997·Granted Apr 11, 2000·6 cites·21 claims
- 1435US5937269AGraphics assisted manufacturing process for thin-film devicesIBM·Filed 1997·Granted Aug 10, 1999·6 cites·20 claims
- 1530US6248599B1Top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1999·Granted Jun 19, 2001·2 cites·3 claims
- 1630US6054749AThin film device repaired using enhanced repair processIBM·Filed 1999·Granted Apr 25, 2000·2 cites·3 claims
- 1730US5972723AEnhanced thin film wiring net repair processIBM·Filed 1997·Granted Oct 26, 1999·2 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →