Inventor · disambiguated record
Yuzo Hamanaka
Also filed as: HAMANAKA YUZO
9 granted patents·285 citations·filing 1998–2005
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0189US6455920B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Sep 24, 2002·72 cites·3 claims
- 0287US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0385US7556985B2Method of fabricating semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 7, 2009·9 cites·1 claims
- 0481US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 0580US6657282B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2002·Granted Dec 2, 2003·19 cites·15 claims
- 0678US7064047B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·16 cites·9 claims
- 0777US6784542B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·15 cites·10 claims
- 0877US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 0973US6987054B2Method of fabricating a semiconductor device having a groove formed in a resin layerFUJITSU LTD·Filed 2002·Granted Jan 17, 2006·12 cites·10 claims
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