Inventor · disambiguated record
Kenichi Nagashige
Also filed as: NAGASHIGE KENICHI
16 granted patents·560 citations·filing 1998–2013
95Inventor score
Top patents by PatentIndex Score
16 records- 0192US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 0289US7112889B1Semiconductor device having an alignment mark formed by the same material with a metal postFUJITSU LTD·Filed 2000·Granted Sep 26, 2006·36 cites·9 claims
- 0389US6563330B1Probe card and method of testing wafer having a plurality of semiconductor devicesFUJITSU LTD·Filed 2000·Granted May 13, 2003·37 cites·18 claims
- 0489US6455920B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Sep 24, 2002·72 cites·3 claims
- 0587US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0685US7556985B2Method of fabricating semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 7, 2009·9 cites·1 claims
- 0781US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 0880US6657282B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2002·Granted Dec 2, 2003·19 cites·15 claims
- 0980US6437432B2Semiconductor device having improved electrical characteristics and method of producing the sameFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·30 cites·17 claims
- 1078US7064047B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·16 cites·9 claims
- 1177US6784542B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·15 cites·10 claims
- 1277US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 1373US6987054B2Method of fabricating a semiconductor device having a groove formed in a resin layerFUJITSU LTD·Filed 2002·Granted Jan 17, 2006·12 cites·10 claims
- 1471US8759119B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Jun 24, 2014·2 cites·4 claims
- 1561US6774650B2Probe card and method of testing wafer having a plurality of semiconductor devicesFUJITSU LTD·Filed 2003·Granted Aug 10, 2004·7 cites·3 claims
- 1653US8404496B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateMARUYAMA SHIGEYUKI·Filed 2006·Granted Mar 26, 2013·1 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →