Inventor · disambiguated record
Liang-Ju Yen
Also filed as: YEN LIANG-JU
3 granted patents·1 pending application·6 citations·filing 2012–2025
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US11393805B23D semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 0274US12224276B23D semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 0373US9583365B2Method of forming interconnects for three dimensional integrated circuitYU CHUN HUI·Filed 2012·Granted Feb 28, 2017·4 cites·18 claims
- 0471US2025158004A1Method of forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →