Inventor · disambiguated record
Tadanori Segawa
Also filed as: SEGAWA TADANORI
10 granted patents·238 citations·filing 1988–2007
90Inventor score
Top patents by PatentIndex Score
10 records- 0191US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0286US4933744AResin encapsulated electronic devicesHITACHI LTD·Filed 1988·Granted Jun 12, 1990·72 cites·30 claims
- 0385US7183650B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2002·Granted Feb 27, 2007·30 cites·11 claims
- 0477US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 0568US6946723B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Sep 20, 2005·13 cites·13 claims
- 0663US4965657AResin encapsulated semiconductor deviceHITACHI LTD·Filed 1988·Granted Oct 23, 1990·13 cites·12 claims
- 0761US7535106B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2007·Granted May 19, 2009·1 cites·2 claims
- 0854US6888230B1Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 1999·Granted May 3, 2005·16 cites·20 claims
- 0950US7217992B2Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 15, 2007·3 cites·12 claims
- 1046US7378333B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Tadanori Segawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →