Inventor · disambiguated record
Srinivasa S. N. Reddy
Also filed as: REDDY SRINIVASA · REDDY SRINIVASA S · REDDY SRINIVASA S N
53 granted patents·6 pending applications·1,010 citations·filing 1982–2013
99Inventor score
Top patents by PatentIndex Score
59 records- 0194US7344679B2Method and apparatus for point of care osmolarity testingIBM·Filed 2005·Granted Mar 18, 2008·23 cites·6 claims
- 0294US6489686B2Multi-cavity substrate structure for discrete devicesIBM·Filed 2001·Granted Dec 3, 2002·58 cites·11 claims
- 0390US6319829B1Enhanced interconnection to ceramic substratesIBM·Filed 1999·Granted Nov 20, 2001·79 cites·11 claims
- 0490US4455202AElectrolytic production of lithium metalSTANDARD OIL CO INDIANA·Filed 1982·Granted Jun 19, 1984·46 cites·21 claims
- 0589US6136419ACeramic substrate having a sealed layerIBM·Filed 1999·Granted Oct 24, 2000·74 cites·29 claims
- 0688US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 0787US6312791B1Multilayer ceramic substrate with anchored padIBM·Filed 2000·Granted Nov 6, 2001·36 cites·19 claims
- 0887US6139666AMethod for producing ceramic surfaces with easily removable contact sheetsIBM·Filed 1999·Granted Oct 31, 2000·88 cites·7 claims
- 0982US6791133B2Interposer capacitor built on silicon wafer and joined to a ceramic substrateIBM·Filed 2002·Granted Sep 14, 2004·30 cites·17 claims
- 1080US6187418B1Multilayer ceramic substrate with anchored padIBM·Filed 1999·Granted Feb 13, 2001·40 cites·35 claims
- 1178US6943108B2Interposer capacitor built on silicon wafer and joined to a ceramic substrateIBM·Filed 2004·Granted Sep 13, 2005·22 cites·18 claims
- 1274US6228682B1Multi-cavity substrate structure for discrete devicesIBM·Filed 1999·Granted May 8, 2001·31 cites·9 claims
- 1374US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 1473US6339527B1Thin film capacitor on ceramicIBM·Filed 1999·Granted Jan 15, 2002·41 cites·20 claims
- 1573US4764341ABonding of pure metal films to ceramicsIBM·Filed 1987·Granted Aug 16, 1988·22 cites·16 claims
- 1672US6900395B2Enhanced high-frequency via interconnection for improved reliabilityIBM·Filed 2002·Granted May 31, 2005·23 cites·1 claims
- 1771US5073180AMethod for forming sealed co-fired glass ceramic structuresIBM·Filed 1991·Granted Dec 17, 1991·42 cites·60 claims
- 1869US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 1964US6653776B1Discrete magnets in dielectric forming metal/ceramic laminate and process thereofIBM·Filed 2000·Granted Nov 25, 2003·4 cites·42 claims
- 2059US6224682B1CVD of metals capable of receiving nickel or alloys thereof using inert contactIBM·Filed 2000·Granted May 1, 2001·5 cites·20 claims
- 2158US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 2257US5869134ACVD of metals capable of receiving nickel or alloys thereof using iodideIBM·Filed 1996·Granted Feb 9, 1999·19 cites·23 claims
- 2356US2008053206A1Method and apparatus for point of care osmolarity testingNATARAJAN GOVINDARAJAN·Filed 2007·Application pending·0 cites
- 2456US2008050282A1Method and apparatus for point of care osmolarity testingNATARAJAN GOVINDARAJAN·Filed 2007·Application pending·0 cites
- 2555US5468445ACeramic via composition, multilayer ceramic circuit containing same, and process for using sameIBM·Filed 1994·Granted Nov 21, 1995·20 cites·6 claims
- 2655US2009140423A1Underbump metallurgy employing sputter-deposited nickel titanium alloyIBM·Filed 2007·Application pending·0 cites
- 2753US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 2853US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 2952US6258191B1Method and materials for increasing the strength of crystalline ceramicIBM·Filed 1998·Granted Jul 10, 2001·18 cites·7 claims
- 3052US5292477ASupersaturation method for producing metal powder with a uniform distribution of dispersants method of uses thereof and structures fabricated therewithIBM·Filed 1992·Granted Mar 8, 1994·20 cites·26 claims
- 3151US6974358B2Discrete magnets in dielectric forming metal/ceramic laminate and process thereofIBM·Filed 2003·Granted Dec 13, 2005·1 cites·33 claims
- 3251US6565917B1Method of forming features on a ceramic substrate using platible pastesIBM·Filed 2000·Granted May 20, 2003·3 cites·21 claims
- 3351US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 3451US4971738AEnhanced removal of carbon from ceramic substrate laminatesIBM·Filed 1988·Granted Nov 20, 1990·16 cites·10 claims
- 3550US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 3649US5532031AI/O pad adhesion layer for a ceramic substrateIBM·Filed 1992·Granted Jul 2, 1996·17 cites·14 claims
- 3749US2009134016A1Underbump metallurgy employing sputter-deposited nickel titanium copper alloyIBM·Filed 2007·Application pending·0 cites
- 3848US5336444ACeramic via composition, multilayer ceramic circuit containing same, and process for using sameIBM·Filed 1992·Granted Aug 9, 1994·14 cites·5 claims
- 3947US7666780B2Alignment verification for C4NP solder transferIBM·Filed 2007·Granted Feb 23, 2010·0 cites·9 claims
- 4046US7683493B2Intermetallic diffusion block device and method of manufactureIBM·Filed 2008·Granted Mar 23, 2010·0 cites·7 claims
- 4146US6569496B1CVD of metals capable of receiving nickel or alloys thereof using inert contactIBM·Filed 1998·Granted May 27, 2003·10 cites·4 claims
- 4246US2013249066A1Electromigration-resistant lead-free solder interconnect structuresARVIN CHARLES L·Filed 2012·Application pending·0 cites
- 4345US5304517AToughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sinteringIBM·Filed 1993·Granted Apr 19, 1994·11 cites·7 claims
- 4443US5139975ASintering arrangement for enhancing removal of carbon from ceramic substrate laminatesIBM·Filed 1991·Granted Aug 18, 1992·12 cites·15 claims
- 4542US6413339B1Low temperature sintering of ferrite materialsIBM·Filed 1999·Granted Jul 2, 2002·7 cites·29 claims
- 4642US2012202343A1Method of forming underbump metallurgy structure employing sputter-deposited nickel copper alloyBELANGER LUC·Filed 2012·Application pending·0 cites
- 4741US5053361ASetter tile for use in sintering of ceramic substrate laminatesIBM·Filed 1990·Granted Oct 1, 1991·10 cites·4 claims
- 4840US6494758B1Process of forming metal/ferrite laminated magnetIBM·Filed 1999·Granted Dec 17, 2002·5 cites·31 claims
- 4940US5525761ACopper-based paste containing refractory metal additions for densification controlIBM·Filed 1995·Granted Jun 11, 1996·7 cites·6 claims
- 5037US5655213ACo-sintered surface metallization for pin-join, wire-bond and chip attachIBM·Filed 1995·Granted Aug 5, 1997·4 cites·6 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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