Inventor · disambiguated record
Hsiu-Ping Wei
Also filed as: WEI HSIU-PING
8 granted patents·2 pending applications·51 citations·filing 2009–2024
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG3APPLE INC2LIU TZUAN-HORNG2TAIWAN SEMICONDUCTOR MFG CO LTD1TSAI HAO-YI1
Top patents by PatentIndex Score
10 records- 0195US8405211B2Bump pad structureTSAI HAO-YI·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 0291US8907478B2Bump pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 9, 2014·9 cites·20 claims
- 0387US8193639B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2010·Granted Jun 5, 2012·8 cites·20 claims
- 0474US8753971B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2012·Granted Jun 17, 2014·3 cites·20 claims
- 0574US8227916B2Package structure and method for reducing dielectric layer delaminationWEI HSIU-PING·Filed 2010·Granted Jul 24, 2012·5 cites·20 claims
- 0669US9536847B2Bump pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·1 cites·20 claims
- 0764US8030776B2Integrated circuit with protective structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 4, 2011·2 cites·14 claims
- 0863US2025253255A1Unitized Finger to Bump Interposer PackageAPPLE INC·Filed 2024·Application pending·0 cites
- 0958US9171811B2Bump pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 27, 2015·0 cites·20 claims
- 1054US2024030158A1Scribe Edge Protection Structure for Semiconductor DevicesAPPLE INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →