Inventor · disambiguated record
Paul Jaynes
Also filed as: JAYNES PAUL · JAYNES PAUL B · JAYNES PAUL BRIAN
16 granted patents·205 citations·filing 1999–2023
94Inventor score
Top patents by PatentIndex Score
16 records- 0193US11657989B2Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including airHARRIS CORP·Filed 2020·Granted May 23, 2023·2 cites·7 claims
- 0288US10818448B2Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including airHARRIS CORP·Filed 2018·Granted Oct 27, 2020·3 cites·7 claims
- 0388US9922783B2Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switchHARRIS CORP·Filed 2015·Granted Mar 20, 2018·4 cites·8 claims
- 0484US7972901B2Chip package sealing methodFOSTER MILLER INC·Filed 2005·Granted Jul 5, 2011·10 cites·3 claims
- 0584US6952046B2Electronic and optoelectronic component packaging techniqueFOSTER MILLER INC·Filed 2003·Granted Oct 4, 2005·29 cites·48 claims
- 0683US6633276B1Adjustable viewing angle flat panel display unit and method of implementing sameSONY CORP·Filed 1999·Granted Oct 14, 2003·64 cites·20 claims
- 0782US8161633B2Method of fabricating non-planar circuit boardSHACKLETTE LAWRENCE W·Filed 2007·Granted Apr 24, 2012·13 cites·21 claims
- 0881US12400810B2Method for making a three-dimensional liquid crystal polymer electronic deviceHARRIS CORP·Filed 2023·Granted Aug 26, 2025·0 cites·7 claims
- 0981US9117602B2Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methodsRENDEK JR LOUIS JOSEPH·Filed 2008·Granted Aug 25, 2015·6 cites·9 claims
- 1081US6977187B2Chip package sealing methodFOSTER MILLER INC·Filed 2003·Granted Dec 20, 2005·24 cites·21 claims
- 1179US7476566B2Electronic and optoelectronic component packaging techniqueFOSTER MILLER INC·Filed 2005·Granted Jan 13, 2009·7 cites·25 claims
- 1274USD434403SCellular telephone handsetSONY CORP·Filed 2000·Granted Nov 28, 2000·24 cites·1 claims
- 1372US7128801B2Method and apparatus for sealing flex circuits having heat sensitive circuit elementsHARRIS CORP·Filed 2005·Granted Oct 31, 2006·4 cites·11 claims
- 1469US7343675B2Method of constructing a structural circuitHARRIS CORP·Filed 2004·Granted Mar 18, 2008·14 cites·18 claims
- 1561US7591924B2Apparatus for sealing flex circuits having heat sensitive circuit elementsHARRIS CORP·Filed 2006·Granted Sep 22, 2009·1 cites·19 claims
- 1641US7768619B2Method and apparatus for sealing flex circuits made with an LCP substrateHARRIS CORP·Filed 2004·Granted Aug 3, 2010·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →