Inventor · disambiguated record
Junichi Saeki
Also filed as: SAEKI JUNICHI
47 granted patents·1,382 citations·filing 1982–2019
99Inventor score
Top patents by PatentIndex Score
47 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0292US6291880B1Semiconductor device including an integrally molded lead frameHITACHI LTD·Filed 1999·Granted Sep 18, 2001·160 cites·11 claims
- 0386US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0485US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 0585US5811877ASemiconductor device structureHITACHI LTD·Filed 1997·Granted Sep 22, 1998·84 cites·26 claims
- 0684US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 0780US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 0880US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 0980US4989166AMethod for synthesizing analysis model and flow analysis systemHITACHI LTD·Filed 1989·Granted Jan 29, 1991·66 cites·12 claims
- 1079US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1178US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 1278US5371044AMethod of uniformly encapsulating a semiconductor device in resinHITACHI LTD·Filed 1992·Granted Dec 6, 1994·60 cites·20 claims
- 1377US4426341ATransfer molding method and transfer molding machineHITACHI LTD·Filed 1982·Granted Jan 17, 1984·34 cites·6 claims
- 1475US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 1575US5200366ASemiconductor device, its fabrication method and molding apparatus used thereforHITACHI LTD·Filed 1991·Granted Apr 6, 1993·60 cites·16 claims
- 1674US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 1773US5572430AMethod and apparatus for cooperated designHITACHI LTD·Filed 1992·Granted Nov 5, 1996·75 cites·9 claims
- 1869US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 1969US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 2067US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 2167US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2267US4946633AMethod of producing semiconductor devicesHITACHI LTD·Filed 1988·Granted Aug 7, 1990·32 cites·25 claims
- 2366US4954301ATransfer molding process and an apparatus for the sameHITACHI LTD·Filed 1989·Granted Sep 4, 1990·31 cites·17 claims
- 2466US4900501AMethod and apparatus for encapsulating semi-conductorsHITACHI LTD·Filed 1986·Granted Feb 13, 1990·31 cites·4 claims
- 2565US11912071B2TireBRIDGESTONE CORP·Filed 2019·Granted Feb 27, 2024·0 cites·14 claims
- 2665US7277771B2Three-dimensional foam analysis method, product design aiding method using the analysis method, and recording medium recording these methodsHITACHI LTD·Filed 2005·Granted Oct 2, 2007·3 cites·4 claims
- 2763US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 2863US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 2962US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 3061US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 3159US7096083B2Design support apparatus and method for supporting design of resin mold productHITACHI LTD·Filed 2003·Granted Aug 22, 2006·11 cites·7 claims
- 3259US5125821AResin flow and curing measuring deviceHITACHI LTD·Filed 1989·Granted Jun 30, 1992·19 cites·13 claims
- 3359US4983110AResin encapsulating apparatus for semiconductor devicesHITACHI LTD·Filed 1989·Granted Jan 8, 1991·23 cites·7 claims
- 3453US8095348B2Support system, support method and support program of resin molded articleSAEKI JUNICHI·Filed 2008·Granted Jan 10, 2012·1 cites·14 claims
- 3553US6861294B2Semiconductor devices and methods of making the devicesRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·4 cites·9 claims
- 3653US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 3753US6465876B1Semiconductor device and lead frame thereforHITACHI LTD·Filed 1997·Granted Oct 15, 2002·16 cites·5 claims
- 3851US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 3951US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 4050US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 4148US7023027B2Diode package having an anode and a cathode formed on one surface of a diode chipRENESAS TECH CORP·Filed 2002·Granted Apr 4, 2006·4 cites·6 claims
- 4247US6844219B2Semiconductor device and lead frame thereforRENESAS TECH CORP·Filed 2002·Granted Jan 18, 2005·2 cites·7 claims
- 4344US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 4441US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 4541US5287284AProduct specification complex analysis systemHITACHI LTD·Filed 1991·Granted Feb 15, 1994·41 cites·12 claims
- 4637US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 4732US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →