Inventor · disambiguated record
Min-Hyo Park
Also filed as: PARK MIN-HYO
4 granted patents·1 pending application·47 citations·filing 2005–2010
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0190US7632719B2Wafer-level chip scale package and method for fabricating and using the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Dec 15, 2009·21 cites·15 claims
- 0287US7936054B2Multi-chip packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted May 3, 2011·22 cites·19 claims
- 0367US7728437B2Semiconductor package form within an encapsulationFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2005·Granted Jun 1, 2010·4 cites·5 claims
- 0442US2009189272A1Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the SamePARK MIN-HYO·Filed 2009·Application pending·0 cites
- 0538US8168475B2Semiconductor package formed within an encapsulationCHOI SEUNG-YONG·Filed 2010·Granted May 1, 2012·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Min-Hyo Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →