Inventor · disambiguated record
Wei Ma
Also filed as: MA WEI · Ma wei ling
3 granted patents·85 citations·filing 2008–2020
68Inventor score
Top patents by PatentIndex Score
3 records- 0193US7683459B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Mar 23, 2010·78 cites·15 claims
- 0274US8138577B2Pulse-laser bonding method for through-silicon-via based stacking of electronic componentsSHI XUNQING·Filed 2008·Granted Mar 20, 2012·7 cites·26 claims
- 0351US11551963B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 10, 2023·0 cites·11 claims
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