Inventor · disambiguated record
Martin Lapke
Also filed as: LAPKE MARTIN
7 granted patents·2 pending applications·33 citations·filing 2011–2017
79Inventor score
Top patents by PatentIndex Score
9 records- 0193US9847258B2Plasma dicing with blade saw patterned underside maskNXP BV·Filed 2015·Granted Dec 19, 2017·16 cites·14 claims
- 0286US8809166B2High die strength semiconductor wafer processing method and systemNXP BV·Filed 2012·Granted Aug 19, 2014·9 cites·9 claims
- 0384US9601437B2Plasma etching and stealth dicing laser processNXP BV·Filed 2014·Granted Mar 21, 2017·7 cites·19 claims
- 0462US9812361B2Combination grinding after laser (GAL) and laser on-off function to increase die strengthNXP BV·Filed 2014·Granted Nov 7, 2017·1 cites·15 claims
- 0544US9349645B2Apparatus, device and method for wafer dicingNXP BV·Filed 2013·Granted May 24, 2016·0 cites·13 claims
- 0643US2016172243A1Wafer material removalNXP BV·Filed 2014·Application pending·0 cites
- 0740US10347534B2Variable stealth laser dicing processNXP BV·Filed 2017·Granted Jul 9, 2019·0 cites·16 claims
- 0838US2014145294A1Wafer separationNXP BV·Filed 2012·Application pending·0 cites
- 0930US9113543B2Device and use of the device for measuring the density and/or the electron temperature and/or the collision frequency of a plasmaBRINKMANN RALF PETER·Filed 2011·Granted Aug 18, 2015·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →