Inventor · disambiguated record
Zhipeng Ding
Also filed as: DING ZHIPENG
2 granted patents·7 pending applications·0 citations·filing 2015–2024
22Inventor score
Files withWUHAN MEMSONICS TECH CO LTD7AGENCY SCIENCE TECH & RES1BEIJING ZITIAO NETWORK TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
9 records- 0152US2025167755A1Bulk Acoustic Wave Resonator and Preparation Method ThereofWUHAN MEMSONICS TECH CO LTD·Filed 2024·Application pending·0 cites
- 0252US2024421789A1Bulk Acoustic Resonator and Preparation Method Thereof and FilterWUHAN MEMSONICS TECH CO LTD·Filed 2024·Application pending·0 cites
- 0351US2025202455A1Film Bulk Acoustic Resonator and Manufacturing Method ThereforWUHAN MEMSONICS TECH CO LTD·Filed 2024·Application pending·0 cites
- 0448US11799440B2Packaging structure and method of acoustic deviceWUHAN MEMSONICS TECH CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 0545US2023318557A1Resonator and Preparation Method for ResonatorWUHAN MEMSONICS TECH CO LTD·Filed 2023·Application pending·0 cites
- 0642US2023091745A1Film Bulk Acoustic Resonator and Manufacturing Method therefor, and Film Bulk Acoustic Wave FilterWUHAN MEMSONICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0742US2023402993A1Film bulk acoustic wave resonator and preparation method thereofWUHAN MEMSONICS TECH CO LTD·Filed 2023·Application pending·0 cites
- 0841US2024163500A1Information display method, apparatus, electronic device and storage mediumBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0938US10134607B2Method for low temperature bonding of wafersAGENCY SCIENCE TECH & RES·Filed 2015·Granted Nov 20, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →