Inventor · disambiguated record
Hisashi Koaizawa
Also filed as: KOAIZAWA HISASHI
20 granted patents·3 pending applications·203 citations·filing 1985–2019
94Inventor score
Files withFURUKAWA ELECTRIC CO LTD17NAKAMURA TOSHIHIRO3FUYUKI TAKASHI1HIRAYAMA TAKESHI1YOKOGAWA ELECTRIC CORP1
Top patents by PatentIndex Score
23 records- 0194US6543257B1Dehydration and sintering apparatus for porous optical fiber preformFURUKAWA ELECTRIC CO LTD·Filed 2000·Granted Apr 8, 2003·47 cites·21 claims
- 0286US5897682AApparatus for cooling an optical fiber to be resin coatedFURUKAWA ELECTRIC CO LTD·Filed 1996·Granted Apr 27, 1999·39 cites·12 claims
- 0375US12408635B2Living marine resource production method and living marine resource production deviceYOKOGAWA ELECTRIC CORP·Filed 2019·Granted Sep 9, 2025·1 cites·12 claims
- 0473US6192715B1Furnace for forming optical fiberFURUKAWA ELECTRIC CO LTD·Filed 1999·Granted Feb 27, 2001·25 cites·16 claims
- 0572US8029327B2Semiconductor device and display device using a one-dimensional substrate and device fabricating method thereofFURUKAWA ELECTRIC CO LTD·Filed 2010·Granted Oct 4, 2011·2 cites·8 claims
- 0672US7883778B2Sheet glass and method for manufacturing sheet glassFURUKAWA ELECTRIC CO LTD·Filed 2007·Granted Feb 8, 2011·2 cites·3 claims
- 0772US6684018B2Low-dispersion optical fiber and optical transmission system using the low-dispersion optical fiberFURUKAWA ELECTRIC CO LTD·Filed 2001·Granted Jan 27, 2004·13 cites·20 claims
- 0870US5449408AOptical fiber coating apparatus and positioning method thereofFURUKAWA ELECTRIC CO LTD·Filed 1992·Granted Sep 12, 1995·34 cites·14 claims
- 0962US6766089B2Low-dispersion optical fiber and optical transmission system using the low-dispersion optical fiberFURUKAWA ELECTRIC CO LTD·Filed 2003·Granted Jul 20, 2004·7 cites·9 claims
- 1060US7079738B2Method for manufacturing a glass doped with a rare earth element and fiber for optical amplification using the sameFURUKAWA ELECTRIC CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·23 claims
- 1159US8778719B2Linear semiconductor substrate, and device, device array and module, using the sameNAKAMURA TOSHIHIRO·Filed 2011·Granted Jul 15, 2014·1 cites·8 claims
- 1258US6284046B1Optical fiber resin coating apparatusFURUKAWA ELECTRIC CO LTD·Filed 1999·Granted Sep 4, 2001·24 cites·7 claims
- 1350US2006257074A1Semiconductor device, display device and device fabricating methodFURUKAWA ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
- 1449US2005257571A1Method and apparatus for manufacturing a glass preformFURUKAWA ELECTRIC CO LTD·Filed 2004·Application pending·0 cites
- 1548US8418503B2Sheet glass and method for manufacturing sheet glassNAKAMURA TOSHIHIRO·Filed 2011·Granted Apr 16, 2013·0 cites·6 claims
- 1647US8673396B2Method of forming continuous thin film and linear glass substrate with thin filmNAKAMURA TOSHIHIRO·Filed 2008·Granted Mar 18, 2014·0 cites·15 claims
- 1747US8598017B2Fiber SOI substrate, semiconductor device using this, and manufacturing method thereofFUYUKI TAKASHI·Filed 2012·Granted Dec 3, 2013·0 cites·3 claims
- 1846US8039927B2Linear semiconductor substrate, and device, device array and module, using the sameFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Oct 18, 2011·0 cites·15 claims
- 1946US7729565B2Fiber sensor and fiber sensor deviceFURUKAWA ELECTRIC CO LTD·Filed 2005·Granted Jun 1, 2010·0 cites·16 claims
- 2046US2009001501A1Fiber Soi Substrate, Semiconductor Device Using Same and Method for Manufacturing SameFURUKAWA ELECTRIC CO LTD·Filed 2005·Application pending·0 cites
- 2137US8758637B2Apparatus and method of removing coating of line-shaped body using plasmaHIRAYAMA TAKESHI·Filed 2008·Granted Jun 24, 2014·0 cites·14 claims
- 2237US4884290AMethod of analyzing composition of optical fiber base material to be measured by radioactive raysFURUKAWA ELECTRIC CO LTD·Filed 1985·Granted Nov 28, 1989·6 cites·12 claims
- 2336US10591135B2LED lighting device, and method of extracting light using LED lighting deviceFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·39 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →