Inventor · disambiguated record
Takanori Kido
Also filed as: KIDO TAKANORI
17 granted patents·364 citations·filing 1997–2018
94Inventor score
Top patents by PatentIndex Score
17 records- 0194US6299659B1Polishing material composition and polishing method for polishing LSI devicesSHOWA DENKO KK·Filed 2000·Granted Oct 9, 2001·66 cites·18 claims
- 0291US5800577APolishing composition for chemical mechanical polishingSHOWA DENKO KK·Filed 1997·Granted Sep 1, 1998·94 cites·7 claims
- 0387US6478836B1Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurrySHOWA DENKO KK·Filed 2000·Granted Nov 12, 2002·38 cites·8 claims
- 0486US6410444B1Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the sameSHOWA DENKO KK·Filed 2001·Granted Jun 25, 2002·35 cites·2 claims
- 0580US6387139B1Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurrySHOWA DENKO KK·Filed 2001·Granted May 14, 2002·22 cites·4 claims
- 0679US6547843B2LSI device polishing composition and method for producing LSI deviceSHOWA DENKO KK·Filed 2001·Granted Apr 15, 2003·21 cites·9 claims
- 0775US9620374B2Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrateSHOWA DENKO KK·Filed 2014·Granted Apr 11, 2017·2 cites·11 claims
- 0874US6733553B2Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the sameSHOWA DENKO KK·Filed 2001·Granted May 11, 2004·18 cites·10 claims
- 0974US6436835B1Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the sameSHOWA DENKO KK·Filed 1999·Granted Aug 20, 2002·39 cites·2 claims
- 1069US11781244B2Seed crystal for single crystal 4H—SiC growth and method for processing the sameSHOWA DENKO KK·Filed 2018·Granted Oct 10, 2023·1 cites·7 claims
- 1168US5935278AAbrasive composition for magnetic recording disc substrateSHOWA DENKO KK·Filed 1997·Granted Aug 10, 1999·21 cites·12 claims
- 1264US9617432B2Primer compositionYOKOHAMA RUBBER CO LTD·Filed 2014·Granted Apr 11, 2017·0 cites·8 claims
- 1362US6844263B2LSI device polishing composition and method for producing LSI deviceSHOWA DENKO KK·Filed 2003·Granted Jan 18, 2005·7 cites·14 claims
- 1460US10453693B2Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrateSHOWA DENKO KK·Filed 2018·Granted Oct 22, 2019·0 cites·8 claims
- 1559US9960048B2Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrateSHOWA DENKO KK·Filed 2017·Granted May 1, 2018·0 cites·9 claims
- 1653US10513644B2Two-pack curable urethane adhesive compositionYOKOHAMA RUBBER CO LTD·Filed 2015·Granted Dec 24, 2019·0 cites·20 claims
- 1744US10793758B2Two-pack type urethane-based adhesive compositionYOKOHAMA RUBBER CO LTD·Filed 2015·Granted Oct 6, 2020·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →