Inventor · disambiguated record
Keng-Hui Liao
Also filed as: LIAO KENG-HUI
3 granted patents·1 pending application·23 citations·filing 1998–2025
62Inventor score
Top patents by PatentIndex Score
4 records- 0178US6604853B2Accelerated thermal stress cycle testTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·22 cites·18 claims
- 0265US2025226231A1Semiconductor structure including discharge structures and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0358US12293918B2Semiconductor structure including discharge structures and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 6, 2025·0 cites·20 claims
- 0426US6110810AProcess for forming N-channel through amorphous silicon (αSi) implantation MOS processMOSEL VITELIC INC·Filed 1998·Granted Aug 29, 2000·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →