Inventor · disambiguated record
Yutaka Hirasawa
Also filed as: HIRASAWA YUTAKA
33 granted patents·4 pending applications·628 citations·filing 1985–2016
98Inventor score
Files withMITSUI MINING & SMELTING CO17MORIYAMA SANGYO KK7TOSHIBA KK5JUKI KK3MITSUI MINING & SMLETING CO LT1
Top patents by PatentIndex Score
37 records- 0195USD550379SLED lampMORIYAMA SANGYO KK·Filed 2006·Granted Sep 4, 2007·76 cites·1 claims
- 0289US6270889B1Making and using an ultra-thin copper foilMITSUI MINING & SMELTING CO·Filed 1998·Granted Aug 7, 2001·64 cites·43 claims
- 0381USD550869SLED lampMORIYAMA SANGYO KK·Filed 2006·Granted Sep 11, 2007·27 cites·1 claims
- 0479US4992931AData alignment correction apparatus for properly formatting data structures for different computer architecturesTOSHIBA KK·Filed 1987·Granted Feb 12, 1991·61 cites·12 claims
- 0578US5437914ACopper-clad laminate and printed wiring boardMITSUI MINING & SMELTING CO·Filed 1993·Granted Aug 1, 1995·46 cites·6 claims
- 0677US6605369B1Surface-treated copper foil and method for producing the sameMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 12, 2003·19 cites·13 claims
- 0775US5545466ACopper-clad laminate and printed wiring boardMITSUI MINING & SMELTING CO·Filed 1995·Granted Aug 13, 1996·37 cites·4 claims
- 0873USD546985SLED lampMORIYAMA SANGYO KK·Filed 2006·Granted Jul 17, 2007·19 cites·1 claims
- 0972US5858517AElectrodeposited copper foil for printed wiring board and method of manufacturing the sameMITSUI MINING & SMELTING CO·Filed 1997·Granted Jan 12, 1999·24 cites·4 claims
- 1071US6610418B1Electolytic copper foil with carrier foil and method for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 26, 2003·7 cites·7 claims
- 1170US6444112B1Manufacturing method of electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Sep 3, 2002·9 cites·9 claims
- 1269US6223667B1Belt-loop sewing machineJUKI KK·Filed 1999·Granted May 1, 2001·11 cites·6 claims
- 1365US4887075ALocal area network system with a multi-computer system coupled thereto and method for controlling the sameTOSHIBA KK·Filed 1988·Granted Dec 12, 1989·28 cites·14 claims
- 1464US6548153B2Composite material used in making printed wiring boardsMITSUI MINING & SMELTING CO·Filed 2002·Granted Apr 15, 2003·10 cites·11 claims
- 1563US6902824B2Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the sameMITSUI MINING & SMELTING CO·Filed 2002·Granted Jun 7, 2005·9 cites·5 claims
- 1663US6319620B1Making and using an ultra-thin copper foilMITSUI MINING & SMELTING CO·Filed 1998·Granted Nov 20, 2001·22 cites·18 claims
- 1761US5897761AElectrodeposited copper foil for printed wiring board and method for manufacturing the sameMITSUI MINING & SMLETING CO LT·Filed 1998·Granted Apr 27, 1999·29 cites·5 claims
- 1857USD505663SLED holderMORIYAMA SANGYO KK·Filed 2004·Granted May 31, 2005·9 cites·1 claims
- 1957US5833819ACopper foil for a printed circuit board, a process and an apparatus for producing the sameMITSUI MINING & SMELTING CO·Filed 1996·Granted Nov 10, 1998·11 cites·4 claims
- 2056US5640917AWelt forming device, and fabric guideJUKI KK·Filed 1995·Granted Jun 24, 1997·8 cites·16 claims
- 2154USD508234SLED holderMORIYAMA SANGYO KK·Filed 2004·Granted Aug 9, 2005·8 cites·1 claims
- 2254US6716572B2Manufacturing process for printed wiring boardMITSUI MINING & SMELTING CO·Filed 2002·Granted Apr 6, 2004·5 cites·11 claims
- 2354US6479170B2Electrodeposited copper foil, method of inspecting physical properties thereof, and copper-clad laminate employing the electrodeposited copper foilMITSUI MINING & SMELTING CO·Filed 2001·Granted Nov 12, 2002·5 cites·3 claims
- 2453US6827867B2Method for manufacturing printed wiring boardMITSUI MINING & SMELTING CO·Filed 2001·Granted Dec 7, 2004·4 cites·4 claims
- 2553US5341363AComputer system capable of disconnecting itself from a lanTOSHIBA KK·Filed 1992·Granted Aug 23, 1994·26 cites·5 claims
- 2652US4675252ABase material having a dyed membrane on the surface thereof, and method for dyeing a membrane thereonNIPPON KAYAKU KK·Filed 1985·Granted Jun 23, 1987·15 cites·9 claims
- 2750US6616827B2Filtration method of copper electrolyteMITSUI MINING & SMELTING CO·Filed 2001·Granted Sep 9, 2003·5 cites·5 claims
- 2847US5029075ARouting method in a computer communication network systemTOSHIBA KK·Filed 1989·Granted Jul 2, 1991·13 cites·5 claims
- 2945USD505662SLED holderMORIYAMA SANGYO KK·Filed 2004·Granted May 31, 2005·5 cites·1 claims
- 3043US2002015833A1Manufacturing method of electrodeposited copper foil and electrodeposited copper foilFiled 2001·Application pending·0 cites
- 3139US2002070120A1Making and using an ultra-thin copper foilFiled 2001·Application pending·0 cites
- 3238USD520657SLED lampMORIYAMA SANGYO KK·Filed 2005·Granted May 9, 2006·3 cites·1 claims
- 3337US5504866ALan control systemTOSHIBA KK·Filed 1994·Granted Apr 2, 1996·9 cites·10 claims
- 3436US2003148136A1Surface treated copper foil, electrodeposited copper foil with carrier, manufacture method for the electrodeposited copper foil with carrier, and copper clad laminateMITSUI MINING & SMELTING CO·Filed 2002·Application pending·0 cites
- 3535US2002004124A1Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring boardFiled 2001·Application pending·0 cites
- 3634US5997710ACopper foil for a printed circuit board, a process and an apparatus for producing the sameMITSUI MINING & SMELTING CO·Filed 1998·Granted Dec 7, 1999·4 cites·5 claims
- 3728US9873965B2Loop material sewing method and loop sewing machineJUKI KK·Filed 2016·Granted Jan 23, 2018·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →