Inventor · disambiguated record
Anthony Yi Sheng Sun
Also filed as: SUN ANTHONY · SUN ANTHONY YI-SHENG
19 granted patents·6 pending applications·365 citations·filing 1977–2016
95Inventor score
Files withUNITED TEST & ASSEMBLY CT LTD8FAUSAK ANDREW T2TEXAS INSTRUMENTS INC2UNITED TEST & ASSEMBLY CT LT2UTAC UNITED TEST AND ASSEMBLY2
Top patents by PatentIndex Score
25 records- 0197US8239073B2Systems and methods for controlling energy consumptionFAUSAK ANDREW T·Filed 2009·Granted Aug 7, 2012·146 cites·12 claims
- 0294US7948095B2Semiconductor package and method of making the sameUNITED TEST & ASSEMBLY CT LT·Filed 2009·Granted May 24, 2011·45 cites·3 claims
- 0393US8793029B2Systems and methods for controlling energy consumptionFAUSAK ANDREW T·Filed 2012·Granted Jul 29, 2014·13 cites·20 claims
- 0492US8115292B2Interposer for semiconductor packageTOH CHIN HOCK·Filed 2009·Granted Feb 14, 2012·37 cites·23 claims
- 0591US7323769B2High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing packageUNITED TEST & ASSEMBLY CT LTD·Filed 2006·Granted Jan 29, 2008·28 cites·20 claims
- 0686US7375416B2Leadframe enhancement and method of producing a multi-row semiconductor packageUNITED TEST & ASSEMBLY CT LTD·Filed 2006·Granted May 20, 2008·15 cites·9 claims
- 0783US7307775B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 11, 2007·35 cites·161 claims
- 0869US7723833B2Stacked die packagesUNITED TEST & ASSEMBLY CT LTD·Filed 2007·Granted May 25, 2010·5 cites·18 claims
- 0967US7345357B2High density chip scale leadframe package and method of manufacturing the packageUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Mar 18, 2008·3 cites·7 claims
- 1065US7830006B2Structurally-enhanced integrated circuit package and method of manufactureUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Nov 9, 2010·4 cites·10 claims
- 1163US7361995B2Molded high density electronic packaging structure for high performance applicationsXILINX INC·Filed 2004·Granted Apr 22, 2008·13 cites·24 claims
- 1262US7476569B2Leadframe enhancement and method of producing a multi-row semiconductor packageUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Granted Jan 13, 2009·2 cites·7 claims
- 1361US8129222B2High density chip scale leadframe package and method of manufacturing the packageTAN HIEN BOON·Filed 2003·Granted Mar 6, 2012·11 cites·2 claims
- 1459US8030768B2Semiconductor package with under bump metallization aligned with open viasUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 1558US7816775B2Multi-die IC package and manufacturing methodUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Oct 19, 2010·2 cites·14 claims
- 1654US2010196286A1Inhalation delivery methods and devicesARMER THOMAS A·Filed 2009·Application pending·0 cites
- 1747US2008096313A1Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer SubstratesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1846US7678610B2Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2005·Granted Mar 16, 2010·1 cites·10 claims
- 1946US2010109169A1Semiconductor package and method of making the sameUNITED TEST & ASSEMBLY CT LTD·Filed 2009·Application pending·0 cites
- 2045US9842792B2Method of producing a semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2016·Granted Dec 12, 2017·0 cites·17 claims
- 2144USD253593SLamp cartridge for optical character recognition readerCAERE CORP·Filed 1977·Granted Dec 4, 1979·3 cites·1 claims
- 2240US9281218B2Method of producing a semiconductor packageRETUTA DANNY·Filed 2007·Granted Mar 8, 2016·0 cites·19 claims
- 2338US2008251938A1Semiconductor chip package and method of manufactureUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
- 2434US2008290509A1Chip Scale Package and Method of Assembling the SameUNITED TEST AND ASSEMBLY CT·Filed 2004·Application pending·0 cites
- 2533US2004124508A1High performance chip scale leadframe package and method of manufacturing the packageUNITED TEST AND ASSEMBLY TEST·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →