Inventor · disambiguated record
John Dzarnoski
Also filed as: DZARNOSKI JOHN · DZARNOSKI JOHN E · DZARNOSKI JR JOHN E
6 granted patents·2 pending applications·95 citations·filing 1989–2016
83Inventor score
Top patents by PatentIndex Score
8 records- 0189US9906879B2Solderless module connector for a hearing assistance device assemblySTARKEY LABS INC·Filed 2015·Granted Feb 27, 2018·12 cites·19 claims
- 0263US4980002AMethod of fabricating a layered electronic assembly having compensation for chips of different thickness and different I/O lead offsetsUNISYS CORP·Filed 1989·Granted Dec 25, 1990·29 cites·12 claims
- 0362US6449132B1Dielectric gap material for magnetoresistive heads with conformal step coverageSEAGATE TECHNOLOGY LLC·Filed 2000·Granted Sep 10, 2002·6 cites·18 claims
- 0461US4959749ALayered electronic assembly having compensation for chips of different thickness and different I/O lead offsetsUNISYS CORP·Filed 1989·Granted Sep 25, 1990·27 cites·12 claims
- 0554US4999311AMethod of fabricating interconnections to I/O leads on layered electronic assembliesUNISYS CORP·Filed 1989·Granted Mar 12, 1991·20 cites·13 claims
- 0644US9913052B2Solderless hearing assistance device assembly and methodSTARKEY LABS INC·Filed 2013·Granted Mar 6, 2018·1 cites·20 claims
- 0732US2018027344A1Folded stacked package with embedded die moduleDZARNOSKI JR JOHN E·Filed 2016·Application pending·0 cites
- 0831US2015071470A1Integrated circuit die inside a flexible circuit substrate for a hearing assistance deviceLINK DOUGLAS F·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →