Inventor · disambiguated record
Sheng-Yao Yang
Also filed as: YANG SHENG · YANG SHENG-YAO
6 granted patents·2 citations·filing 2019–2023
71Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4NANJING HYDRAULIC RESEARCH INSTITUTE UNDER THE MINISTRY OF WATER RESOURCES THE MINISTRY OF TRANSP AN1UNIV SOUTHWEST PETROLEUM1
Top patents by PatentIndex Score
6 records- 0184US12183709B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0282US11088108B2Chip package structure including ring-like structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0379US11848302B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0473US11545463B2Chip package structure with ring-like structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 0564US12487373B2Denoising methods and systems for preserving amplitude variation with offset (AVO) features of pre-stack seismic dataUNIV SOUTHWEST PETROLEUM·Filed 2023·Granted Dec 2, 2025·0 cites·12 claims
- 0634US11198984B2Underwater repair system for cavity region of concrete panel rock-fill dam panelNANJING HYDRAULIC RESEARCH INSTITUTE UNDER THE MINISTRY OF WATER RESOURCES THE MINISTRY OF TRANSP AN·Filed 2019·Granted Dec 14, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →