Inventor · disambiguated record
Kevin A. Dore
Also filed as: DORE II KEVIN A · DORE KEVIN A · DORE KEVIN ARTHUR · DORE KEVIN P
4 granted patents·3 pending applications·126 citations·filing 1999–2018
77Inventor score
Top patents by PatentIndex Score
7 records- 0187US6239484B1Underfill of chip-under-chip semiconductor modulesIBM·Filed 1999·Granted May 29, 2001·88 cites·18 claims
- 0271US8841209B2Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the methodALLARD SYLVIE·Filed 2011·Granted Sep 23, 2014·4 cites·14 claims
- 0369US6291267B1Process for underfilling chip-under-chip semiconductor modulesIBM·Filed 1999·Granted Sep 18, 2001·33 cites·19 claims
- 0461US11257001B2Prediction model enhancementIBM·Filed 2018·Granted Feb 22, 2022·1 cites·8 claims
- 0556US2009155552A1Ic chip package substrate having outermost glass fiber reinforced epoxy layers and related methodIBM·Filed 2007·Application pending·0 cites
- 0645US2009294971A1Electroless nickel leveling of lga pad sites for high performance organic lgaIBM·Filed 2008·Application pending·0 cites
- 0739US2006261225A1Mount for attaching a portable fan to a recreational vehicle awningDORE KEVIN P·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →