Inventor · disambiguated record
Sim Ying Yong
Also filed as: YONG SIM Y · YONG SIM YING
5 granted patents·4 pending applications·115 citations·filing 2004–2014
80Inventor score
Top patents by PatentIndex Score
9 records- 0193US7616448B2Wrap-around overmold for electronic assemblyDELPHI TECH INC·Filed 2007·Granted Nov 10, 2009·43 cites·7 claims
- 0288US7455552B1Overmolded electronic assembly with metal seal ringDELPHI TECH INC·Filed 2008·Granted Nov 25, 2008·22 cites·7 claims
- 0383US7148554B2Discrete electronic component arrangement including anchoring, thermally conductive padDELPHI TECH INC·Filed 2004·Granted Dec 12, 2006·45 cites·20 claims
- 0453US9231124B2Ball grid array packaged camera device soldered to a substrateDELPHI TECH INC·Filed 2013·Granted Jan 5, 2016·0 cites·8 claims
- 0553US7462077B2Overmolded electronic assemblyDELPHI TECH INC·Filed 2006·Granted Dec 9, 2008·5 cites·7 claims
- 0645US2016006908A1Molded cameraDELPHI TECH INC·Filed 2014·Application pending·0 cites
- 0735US2009197478A1Interlocking overmold for electronic assemblyMANDEL LARRY M·Filed 2008·Application pending·0 cites
- 0831US2005173152A1Circuit board surface mount packageFiled 2004·Application pending·0 cites
- 0930US2006044771A1Electronic module with conductive polymerYEO CHEE K·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →