Inventor · disambiguated record
Tomoko Kishimoto
Also filed as: KISHIMOTO TOMOKO
3 granted patents·6 pending applications·36 citations·filing 2004–2017
70Inventor score
Top patents by PatentIndex Score
9 records- 0188US9453255B2Sample analysis chip, sample analysis method and gene analysis methodTOPPAN PRINTING CO LTD·Filed 2014·Granted Sep 27, 2016·18 cites·25 claims
- 0284US7811647B2Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Oct 12, 2010·11 cites·9 claims
- 0378US7691225B2Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherendNITTO DENKO CORP·Filed 2008·Granted Apr 6, 2010·7 cites·18 claims
- 0456US2010119816A1Heat-peelabe pressure-sensitive adhesive sheet containing layered silicate and process for the production for electronic components by the use of the sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 0549US2008038540A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0649US2008008831A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0744US2011200744A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 0841US2005136251A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 0941US2019077123A1Translucent material, low-adhesion material, and molding memberTOWA CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →