Inventor · disambiguated record
Woo Jae Jeong
Also filed as: JEONG WOO JAE
17 granted patents·7 pending applications·12 citations·filing 2011–2024
88Inventor score
Top patents by PatentIndex Score
24 records- 0184US9416243B2Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resistLG CHEMICAL LTD·Filed 2014·Granted Aug 16, 2016·3 cites·22 claims
- 0282US11811434B2Device and method for transmitting and receiving emulated Wi-Fi packetsKOREA ADVANCED INST SCI & TECH·Filed 2020·Granted Nov 7, 2023·2 cites·20 claims
- 0381US9134609B2Photo-curable and thermo-curable resin compostion, and dry film solder resistLG CHEMICAL LTD·Filed 2014·Granted Sep 15, 2015·2 cites·25 claims
- 0474US8349538B2Photo-curable and thermo-curable resin composition, and a dry film solder resistLG CHEMICAL LTD·Filed 2011·Granted Jan 8, 2013·2 cites·2 claims
- 0569US2025347032A1Composite fiber and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0668US12448490B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2023·Granted Oct 21, 2025·0 cites·4 claims
- 0767US8334092B2Photo-sensitive resin composition and a protective film for printed circuit board having superior heat resistant and mechanical propertyCHOI BO-YUN·Filed 2011·Granted Dec 18, 2012·2 cites·17 claims
- 0867US2025136448A1Method for carbonizing a polymer and a graphite prepared by the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0967US2025297048A1(meth)acrylate-based resin, and dry film solder resist comprising sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 1065US2025327217A1Method of manufacturing carbon fiber and carbon fiber manufactured therebyHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1163US9880467B2Photo-curable and thermo-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jan 30, 2018·1 cites·16 claims
- 1263US2024060215A1Composite fiber and method of manufacturing sameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1361US12404610B2MXene fibers and preparation method thereofIUCF HYU·Filed 2020·Granted Sep 2, 2025·0 cites·16 claims
- 1461US11515245B2Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the sameLG CHEMICAL LTD·Filed 2018·Granted Nov 29, 2022·0 cites·14 claims
- 1561US9389504B2Photo-curable and thermo-curable resin composition, and dry film solder resistLG CHEMICAL LTD·Filed 2013·Granted Jul 12, 2016·0 cites·18 claims
- 1656US12313973B2Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing sameLG CHEMICAL LTD·Filed 2020·Granted May 27, 2025·0 cites·15 claims
- 1755US2024384441A1Mxene composite fibers and manufacturing method thereofHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 1851US11702520B2Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the sameLG CHEMICAL LTD·Filed 2019·Granted Jul 18, 2023·0 cites·6 claims
- 1951US10795259B2Photo-curable and heat-curable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2017·Granted Oct 6, 2020·0 cites·20 claims
- 2048US9778566B2Photocurable and thermocurable resin composition and dry film solder resistLG CHEMICAL LTD·Filed 2015·Granted Oct 3, 2017·0 cites·23 claims
- 2146US9788434B2Preparation method for dry film solder resist and film laminate used thereinLG CHEMICAL LTD·Filed 2014·Granted Oct 10, 2017·0 cites·16 claims
- 2244US11361878B2Method for manufacturing insulating film and semiconductor packageLG CHEMICAL LTD·Filed 2018·Granted Jun 14, 2022·0 cites·17 claims
- 2332US2012070780A1Photosensitive resin composition, dry film solder resist, and circuit boardCHOI BO-YUN·Filed 2011·Application pending·0 cites
- 2431US9865480B2Printed circuit board including under-fill dam and fabrication method thereofCHOI BYUNG-JU·Filed 2011·Granted Jan 9, 2018·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →