Inventor · disambiguated record
Huei-Ru Tsai
Also filed as: TSAI HUEI-RU
6 granted patents·2 pending applications·12 citations·filing 2012–2018
72Inventor score
Top patents by PatentIndex Score
8 records- 0185US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 0266US10153231B2Interconnect structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·1 cites·14 claims
- 0349US10446489B2Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·8 claims
- 0449US9412653B2Through silicon via (TSV) processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·0 cites·11 claims
- 0547US9136170B2Through silicon via (TSV) structure and process thereofChen jia-jia·Filed 2012·Granted Sep 15, 2015·0 cites·8 claims
- 0642US10079177B1Method for forming copper material over substrateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·0 cites·18 claims
- 0739US2015093893A1Process of forming seed layer in vertical trench/viaUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 0827US2016276215A1Method for Manufacturing Semiconductor DeviceUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →