Inventor · disambiguated record

Jayeon Lee

Also filed as: LEE JAYEON

4 granted patents·3 pending applications·2 citations·filing 2020–2025

61Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD7

Top patents by PatentIndex Score

7 records

0194US11923343B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·20 claims
0284US2025300140A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
0382US12362328B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
0470US11538792B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
0556US2024088092A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
0653US2024079299A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
0747US11791282B2Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·16 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →