Inventor · disambiguated record
Will K. Wong
Also filed as: WONG WILL · WONG WILL K · WONG WILL KIANG
11 granted patents·8 pending applications·47 citations·filing 2007–2014
87Inventor score
Files withNAT SEMICONDUCTOR CORP9PODDAR ANINDYA3TEXAS INSTRUMENTS INC3CHARTERED SEMICONDUCTOR MFG1FENG TAO1
Top patents by PatentIndex Score
19 records- 0189US8450151B1Micro surface mount device packagingPODDAR ANINDYA·Filed 2011·Granted May 28, 2013·13 cites·12 claims
- 0289US7836586B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 23, 2010·15 cites·11 claims
- 0376US7932152B2Method of forming a gate stack structureCHARTERED SEMICONDUCTOR MFG·Filed 2008·Granted Apr 26, 2011·8 cites·25 claims
- 0475US8101470B2Foil based semiconductor packagePODDAR ANINDYA·Filed 2009·Granted Jan 24, 2012·7 cites·19 claims
- 0561US9899794B2Optoelectronic packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 20, 2018·1 cites·11 claims
- 0661US8298871B2Method and leadframe for packaging integrated circuitsWONG WILL K·Filed 2011·Granted Oct 30, 2012·2 cites·12 claims
- 0758US8375577B2Method of making foil based semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Feb 19, 2013·1 cites·11 claims
- 0853US8857047B2Thin foil semiconductor packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Oct 14, 2014·0 cites·6 claims
- 0953US8377267B2Foil plating for semiconductor packagingNAT SEMICONDUCTOR CORP·Filed 2009·Granted Feb 19, 2013·0 cites·11 claims
- 1050US2009160039A1Method and leadframe for packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 1149US8747640B2Foil plating for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2012·Granted Jun 10, 2014·0 cites·4 claims
- 1249US8341828B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2010·Granted Jan 1, 2013·0 cites·5 claims
- 1348US2010084748A1Thin foil for use in packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
- 1444US2008290482A1Method of packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 1543US2008241991A1Gang flipping for flip-chip packagingNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 1638US2012326300A1Low profile package and methodFENG TAO·Filed 2011·Application pending·0 cites
- 1738US2013127044A1Micro surface mount device packagingPODDAR ANINDYA·Filed 2011·Application pending·0 cites
- 1834US2011269269A1Laser ablation alternative to low cost leadframe processNAT SEMICONDUCTOR CORP·Filed 2010·Application pending·0 cites
- 1931US2012074561A1Backmetal replacement for use in the packaging of integrated circuitsTU NGHIA T·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →