Inventor · disambiguated record
Chieh-Fu Lin
Also filed as: LIN CHIEH · LIN CHIEH-FU
8 granted patents·7 pending applications·66 citations·filing 2000–2019
84Inventor score
Files withAPAQ TECHNOLOGY CO LTD6ETERNAL CHEMICAL CO LTD2GEMMY ELECTRONICS CO LTD2ETERNAL MAT CO LTD1GEMMY ELECTRONIC CO LTD1
Top patents by PatentIndex Score
15 records- 0174US7570479B2Solid electrolytic capacitorGEMMY ELECTRONICS CO LTD·Filed 2007·Granted Aug 4, 2009·10 cites·14 claims
- 0270US6898066B1Structure of chip type electrolytic capacitorFiled 2004·Granted May 24, 2005·20 cites·10 claims
- 0368US9613757B2Conductive polymer composite and preparation and use thereofETERNAL CHEMICAL CO LTD·Filed 2013·Granted Apr 4, 2017·2 cites·9 claims
- 0468US2019194441A1Method for manufacturing a polymer composite material and method for manufacturing a capacitor package structure using the polymer composite materialAPAQ TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 0567US6442014B1Chip type capacitorFiled 2001·Granted Aug 27, 2002·18 cites·10 claims
- 0663US6292348B1Surface mounted capacitorFiled 2000·Granted Sep 18, 2001·15 cites·5 claims
- 0756US9691551B2Electrolyte material formulation, electrolyte material composition formed therefrom and use thereofETERNAL CHEMICAL CO LTD·Filed 2012·Granted Jun 27, 2017·0 cites·13 claims
- 0854US9947480B2Electrolyte material formulation, electrolyte material composition formed therefrom and use thereofETERNAL MAT CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·6 claims
- 0950US7969160B2Electrolytic capacitorGEMMY ELECTRONICS CO LTD·Filed 2009·Granted Jun 28, 2011·1 cites·8 claims
- 1046US2019279826A1Method for forming polymer composite material on capacitor elementAPAQ TECHNOLOGY CO LTD·Filed 2018·Application pending·0 cites
- 1146US2019019626A1Polymer composite material for solid capacitor, capacitor package structure using the same and manufacturing method thereofAPAQ TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
- 1245US2019198189A1Conductive polymer dispersion for capacitor and capacitor package structureAPAQ TECHNOLOGY CO LTD·Filed 2018·Application pending·0 cites
- 1340US2019189359A1Printable conductive composite slurry, capacitor and method for manufacturing capacitorAPAQ TECHNOLOGY CO LTD·Filed 2018·Application pending·0 cites
- 1438US2013010403A1Electrolytic material formulation, electrolytic material composition formed therefrom and use thereofGEMMY ELECTRONIC CO LTD·Filed 2012·Application pending·0 cites
- 1538US2018233299A1Capacitor package structure and anti-oxidation electrode foil thereofAPAQ TECHNOLOGY CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →