Inventor · disambiguated record
Manuel Carmona
Also filed as: CARMONA MANUEL
5 granted patents·3 pending applications·54 citations·filing 2005–2007
80Inventor score
Top patents by PatentIndex Score
8 records- 0184US7230831B2Heat sink for surface-mounted semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 12, 2007·20 cites·19 claims
- 0283US7781900B2Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 24, 2010·14 cites·23 claims
- 0372US7256070B2Substrate-based housing component with a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 14, 2007·6 cites·10 claims
- 0471US7368322B2Method for mounting a chip on a base and arrangement produced by this methodINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 6, 2008·6 cites·24 claims
- 0567US7745747B2Microswitch with a first actuated portion and a second contact portionSEIKO EPSON CORP·Filed 2007·Granted Jun 29, 2010·8 cites·7 claims
- 0643US2008079142A1Wafer-level MEMS package and manufacturing method thereofSEIKO EPSON CORP·Filed 2007·Application pending·0 cites
- 0730US2005285247A1Substrate-based die package with BGA or BGA-like componentsREISS MARTIN·Filed 2005·Application pending·0 cites
- 0830US2005285266A1Arrangement for increasing the reliability of substrate-based BGA packagesREISS MARTIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →