Inventor · disambiguated record
Yogendra Ranade
Also filed as: RANADE YOGENDRA
4 granted patents·5 pending applications·21 citations·filing 2001–2013
71Inventor score
Top patents by PatentIndex Score
9 records- 0166US6759921B1Characteristic impedance equalizer and an integrated circuit package employing the sameLSI LOGIC CORP·Filed 2001·Granted Jul 6, 2004·13 cites·18 claims
- 0255US7354790B2Method and apparatus for avoiding dicing chip-outs in integrated circuit dieLSI LOGIC CORP·Filed 2005·Granted Apr 8, 2008·2 cites·18 claims
- 0345US2013203483A1Virtual currency based online social wagering system and methodJOSHI ASHISH·Filed 2013·Application pending·0 cites
- 0444US7145232B2Construction to improve thermal performance and reduce die backside warpageLSI LOGIC CORP·Filed 2004·Granted Dec 5, 2006·5 cites·14 claims
- 0543US6825066B2Stiffener designLSI LOGIC CORP·Filed 2002·Granted Nov 30, 2004·1 cites·20 claims
- 0637US2006043603A1Low temperature PB-free processing for semiconductor devicesLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 0737US2006131283A1Method and apparatus for forming angled vias in an integrated circuit package substrateLSI LOGIC CORP·Filed 2004·Application pending·0 cites
- 0834US2004099962A1Flip chip electrical test yields by countering substrate die area coplanarityFiled 2002·Application pending·0 cites
- 0933US2007013068A1Integrated circuit package and method with an electrical component embedded in a substrate viaLSI LOGIC CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →