Inventor · disambiguated record
Michael G. Lee
Also filed as: LEE MICHAEL · LEE MICHAEL G · LEE MICHAEL GUANG-TZONG · LEE MICHAEL V
83 granted patents·8 pending applications·4,497 citations·filing 1980–2017
99Inventor score
Top patents by PatentIndex Score
91 records- 0199US6444921B1Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the likeFUJITSU LTD·Filed 2000·Granted Sep 3, 2002·200 cites·39 claims
- 0298US6690845B1Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 2000·Granted Feb 10, 2004·334 cites·19 claims
- 0398US6343171B1Systems based on opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 29, 2002·429 cites·26 claims
- 0498US6239485B1Reduced cross-talk noise high density signal interposer with power and ground wrapFUJITSU LTD·Filed 1999·Granted May 29, 2001·194 cites·6 claims
- 0598US6187652B1Method of fabrication of multiple-layer high density substrateFUJITSU LTD·Filed 1998·Granted Feb 13, 2001·177 cites·18 claims
- 0698US6050832AChip and board stress relief interposerFUJITSU LTD·Filed 1998·Granted Apr 18, 2000·221 cites·17 claims
- 0797US6845184B1Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Jan 18, 2005·286 cites·25 claims
- 0897US5454161AThrough hole interconnect substrate fabrication processFUJITSU LTD·Filed 1993·Granted Oct 3, 1995·256 cites·26 claims
- 0996US9496248B2Interposer for integrated circuit chip packageFUJITSU LTD·Filed 2014·Granted Nov 15, 2016·34 cites·12 claims
- 1096US6800169B2Method for joining conductive structures and an electrical conductive articleFUJITSU LTD·Filed 2002·Granted Oct 5, 2004·107 cites·18 claims
- 1196US6611635B1Opto-electronic substrates with electrical and optical interconnections and methods for makingFUJITSU LTD·Filed 1999·Granted Aug 26, 2003·193 cites·45 claims
- 1296US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 1394US6733685B2Methods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 2001·Granted May 11, 2004·64 cites·14 claims
- 1494US5419038AMethod for fabricating thin-film interconnectorFUJITSU LTD·Filed 1993·Granted May 30, 1995·96 cites·33 claims
- 1592US6163957AMultilayer laminated substrates with high density interconnects and methods of making the sameFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·138 cites·19 claims
- 1691US6469394B1Conductive interconnect structures and methods for forming conductive interconnect structuresFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·63 cites·16 claims
- 1790US7516485B1Method and apparatus for securely transmitting encrypted data through a firewall and for monitoring user trafficNORTEL NETWORKS LTD·Filed 2001·Granted Apr 7, 2009·79 cites·12 claims
- 1890US6662443B2Method of fabricating a substrate with a via connectionFUJITSU LTD·Filed 2001·Granted Dec 16, 2003·47 cites·46 claims
- 1989US8859335B2Method and system for controlling chip inclination during flip-chip mountingFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·11 cites·15 claims
- 2089US7781867B2Method and system for providing an aligned semiconductor assemblyFUJITSU LTD·Filed 2007·Granted Aug 24, 2010·16 cites·12 claims
- 2189US6884313B2Method and system for joining and an ultra-high density interconnectFUJITSU LTD·Filed 2001·Granted Apr 26, 2005·56 cites·17 claims
- 2289US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 2389US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 2489US5476430AExercise treadmill with variable response to foot impact induced speed variationLUMEX·Filed 1994·Granted Dec 19, 1995·129 cites·11 claims
- 2588US7522783B2Optical interconnect apparatuses and electro-optic modulators for processing systemsFUJITSU LTD·Filed 2006·Granted Apr 21, 2009·11 cites·10 claims
- 2687US5872696ASputtered and anodized capacitors capable of withstanding exposure to high temperaturesFUJITSU LTD·Filed 1997·Granted Feb 16, 1999·69 cites·32 claims
- 2786US6518096B2Interconnect assembly and Z-connection method for fine pitch substratesFUJITSU LTD·Filed 2001·Granted Feb 11, 2003·39 cites·26 claims
- 2886US6081026AHigh density signal interposer with power and ground wrapFUJITSU LTD·Filed 1998·Granted Jun 27, 2000·61 cites·6 claims
- 2985US7209621B2Optical apparatuses providing optical interconnections among a plurality of electronic componentsFUJITSU LTD·Filed 2004·Granted Apr 24, 2007·30 cites·25 claims
- 3085US6823097B2Optical switching apparatus with divergence correctionFUJITSU LTD·Filed 2002·Granted Nov 23, 2004·28 cites·27 claims
- 3185US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 3284US7171065B2Compact optical devices and methods for making the sameFUJITSU LTD·Filed 2005·Granted Jan 30, 2007·13 cites·28 claims
- 3382US6922508B2Optical switching apparatus with adiabatic coupling to optical fiberFUJITSU LTD·Filed 2002·Granted Jul 26, 2005·23 cites·18 claims
- 3481USD299861SMedical monitorSPACELABS INC·Filed 1986·Granted Feb 14, 1989·21 cites·1 claims
- 3580US8487428B2Method and system for providing a reliable semiconductor assemblyLEE MICHAEL G·Filed 2007·Granted Jul 16, 2013·10 cites·22 claims
- 3680USD300359SRecorder for a medical monitorSPACELABS INC·Filed 1986·Granted Mar 21, 1989·20 cites·1 claims
- 3777US7453058B2Optical bumps for low-loss interconnection between a device and its supported substrate and related methodsFUJITSU LTD·Filed 2005·Granted Nov 18, 2008·4 cites·13 claims
- 3877US5891354AMethods of etching through wafers and substrates with a composite etch stop layerFUJITSU LTD·Filed 1996·Granted Apr 6, 1999·50 cites·20 claims
- 3977USD296240SMedical monitorSPACELABS INC·Filed 1985·Granted Jun 14, 1988·19 cites·1 claims
- 4075US6428942B1Multilayer circuit structure build up methodFUJITSU LTD·Filed 1999·Granted Aug 6, 2002·32 cites·63 claims
- 4174US6197664B1Method for electroplating vias or through holes in substrates having conductors on both sidesFUJITSU LTD·Filed 1999·Granted Mar 6, 2001·35 cites·9 claims
- 4274US5916453AMethods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 1996·Granted Jun 29, 1999·38 cites·22 claims
- 4373US7343054B1Integrated electro-optic module for high speed data transmissionFUJITSU LTD·Filed 2007·Granted Mar 11, 2008·6 cites·22 claims
- 4472US8975092B2Method and system for controlling chip warpage during bondingFUJITSU LTD·Filed 2012·Granted Mar 10, 2015·3 cites·13 claims
- 4572US8236606B2Method and system for providing a low-profile semiconductor assemblyLEE MICHAEL G·Filed 2010·Granted Aug 7, 2012·3 cites·10 claims
- 4672US7376295B2Opto-electronic processors with reconfigurable chip-to-chip optical interconnectionsFUJITSU LTD·Filed 2004·Granted May 20, 2008·13 cites·19 claims
- 4772US7350233B1Fast re-establishment of communications for virtual private network devicesNORTEL NETWORKS LTD·Filed 2003·Granted Mar 25, 2008·20 cites·17 claims
- 4870US7275109B1Network communication authenticationNORTEL NETWORKS LTD·Filed 2002·Granted Sep 25, 2007·14 cites·24 claims
- 4970US6543674B2Multilayer interconnection and methodFUJITSU LTD·Filed 2001·Granted Apr 8, 2003·15 cites·19 claims
- 5070US5323520AProcess for fabricating a substrate with thin film capacitorFUJITSU LTD·Filed 1993·Granted Jun 28, 1994·35 cites·26 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →