Inventor · disambiguated record
Hitoshi Hoshino
Also filed as: HOSHINO HITOSHI
37 granted patents·15 pending applications·171 citations·filing 1980–2021
97Inventor score
Top patents by PatentIndex Score
52 records- 0196US11201126B2Method of producing a substrate and system for producing a substrateDISCO CORP·Filed 2020·Granted Dec 14, 2021·4 cites·12 claims
- 0284US8318518B2Light emitting device and manufacturing method thereofHOSHINO HITOSHI·Filed 2010·Granted Nov 27, 2012·6 cites·1 claims
- 0383US10242913B2Method of processing a wafer and wafer processing systemDISCO CORP·Filed 2018·Granted Mar 26, 2019·3 cites·14 claims
- 0483US8049134B2Laser processing machineDISCO CORP·Filed 2008·Granted Nov 1, 2011·7 cites·2 claims
- 0582US8497189B1Processing method for waferHOSHINO HITOSHI·Filed 2012·Granted Jul 30, 2013·4 cites·4 claims
- 0681US10727128B2Method of processing a waferDISCO CORP·Filed 2019·Granted Jul 28, 2020·3 cites·10 claims
- 0780US11133219B2Method of processing a waferDISCO CORP·Filed 2019·Granted Sep 28, 2021·2 cites·10 claims
- 0879US7745311B2Working method for an optical device waferDISCO CORP·Filed 2009·Granted Jun 29, 2010·6 cites·4 claims
- 0977US9935010B2Method of processing a wafer and wafer processing systemDISCO CORP·Filed 2017·Granted Apr 3, 2018·2 cites·12 claims
- 1077US4350563ADry etching of metal filmFUJITSU LTD·Filed 1980·Granted Sep 21, 1982·43 cites·12 claims
- 1176US8518730B2Sapphire wafer dividing methodHOSHINO HITOSHI·Filed 2011·Granted Aug 27, 2013·3 cites·3 claims
- 1274US8673695B2Sapphire wafer dividing methodOKAMURA TAKASHI·Filed 2011·Granted Mar 18, 2014·3 cites·1 claims
- 1374US8048780B2Method of processing optical device waferDISCO CORP·Filed 2009·Granted Nov 1, 2011·4 cites·3 claims
- 1473US7977215B2Method of processing optical device waferDISCO CORP·Filed 2009·Granted Jul 12, 2011·3 cites·6 claims
- 1572US7408661B2Control apparatus and its method, and control program and storage medium holding it, with access designating second address being performed based on link to the second address included in display informationCANON KK·Filed 2002·Granted Aug 5, 2008·9 cites·17 claims
- 1671US7662700B2Optical device wafer dividing methodDISCO CORP·Filed 2009·Granted Feb 16, 2010·2 cites·4 claims
- 1770US7396780B2Method for laser processing of waferDISCO CORP·Filed 2005·Granted Jul 8, 2008·4 cites·1 claims
- 1865US6538310B2LSI package with internal wire patterns to connect and mount bare chip to substrateNEC CORP·Filed 2001·Granted Mar 25, 2003·12 cites·5 claims
- 1963US11626324B2Method of processing a waferDISCO CORP·Filed 2021·Granted Apr 11, 2023·0 cites·15 claims
- 2061US8946056B2Splitting method for optical device waferUENO HIROUMI·Filed 2012·Granted Feb 3, 2015·2 cites·3 claims
- 2161US7802237B2Method, system and computer program product for generating programDENSO CORP·Filed 2005·Granted Sep 21, 2010·2 cites·27 claims
- 2261US7548333B2Data transfer method and image formation systemCANON KK·Filed 2003·Granted Jun 16, 2009·5 cites·4 claims
- 2359US7134942B2Wafer processing methodDISCO CORP·Filed 2004·Granted Nov 14, 2006·6 cites·4 claims
- 2459US6061579AHand-held mobile phone terminalADVANCED SPACE COMMUNICATIONS·Filed 1997·Granted May 9, 2000·28 cites·8 claims
- 2558US9455229B2Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor elementNAMIKI PRECISION JEWEL CO LTD·Filed 2013·Granted Sep 27, 2016·1 cites·6 claims
- 2657US8040536B2Image data communication in image processing systemCANON KK·Filed 2004·Granted Oct 18, 2011·3 cites·12 claims
- 2756US2008128953A1Workpiece dividing method utilizing laser beamNAGAI YUSUKE·Filed 2007·Application pending·0 cites
- 2854US12249134B2Visualization method, program for the same, visualization device, and discrimination device having the sameROXY CORP·Filed 2021·Granted Mar 11, 2025·0 cites·25 claims
- 2954US2004232124A1Workpiece dividing method utilizing laser beamFiled 2004·Application pending·0 cites
- 3053US7738131B2Control apparatus and its method, and control program and storage medium holding itCANON KK·Filed 2008·Granted Jun 15, 2010·0 cites·17 claims
- 3153US2007156920A1Control apparatus and its method, and control program and storage medium holding it, with changing of transmission sourceCANON KK·Filed 2006·Application pending·0 cites
- 3252US8028367B2Vehicle wiper apparatusMITSUBISHI MOTOR ENG·Filed 2006·Granted Oct 4, 2011·2 cites·6 claims
- 3349US2008003708A1Method of processing sapphire substrateHOSHINO HITOSHI·Filed 2007·Application pending·0 cites
- 3447US10211076B2Wafer processing methodDISCO CORP·Filed 2017·Granted Feb 19, 2019·0 cites·1 claims
- 3547US2006255022A1Wafer laser processing method and laser beam processing machineHOSHINO HITOSHI·Filed 2006·Application pending·0 cites
- 3646US12224207B2Method of processing a workpiece and system for processing a workpieceDISCO CORP·Filed 2020·Granted Feb 11, 2025·0 cites·19 claims
- 3746US2006099774A1Method of laser processing a gallium nitride substrateDISCO CORP·Filed 2005·Application pending·0 cites
- 3845US10682728B2Method of processing a substrateDISCO CORP·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 3944US2005155954A1Semiconductor wafer processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 4042US6653168B2LSI package and internal connecting method used thereforNEC CORP·Filed 2003·Granted Nov 25, 2003·1 cites·5 claims
- 4141US2011254863A1In-vehicle display deviceDENSO CORP·Filed 2011·Application pending·0 cites
- 4241US2006035411A1Laser processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 4340US10650775B2Display control deviceDENSO CORP·Filed 2018·Granted May 12, 2020·0 cites·8 claims
- 4439US2012018732A1Inside reforming substrate for epitaxial growth; crystal film forming element, device, and bulk substrate produced using the same; and method for producing the sameAIDA HIDEO·Filed 2009·Application pending·0 cites
- 4534US9065032B2Method for manufacturing light-emitting element, and light-emitting elementAIDA HIDEO·Filed 2012·Granted Jun 23, 2015·0 cites·7 claims
- 4633US10733962B2Image generation deviceDENSO CORP·Filed 2016·Granted Aug 4, 2020·0 cites·4 claims
- 4732US2016265140A1Single crystal substrate, manufacturing method for single crystal substrate, manufacturing method for single crystal substrate with multilayer film, and element manufacturing methodNAMIKI PRECISION JEWEL CO LTD·Filed 2016·Application pending·0 cites
- 4830US5242838AMethod of manufacturing a semiconductor deviceNEC CORP·Filed 1992·Granted Sep 7, 1993·1 cites·4 claims
- 4928US2013161794A1Internally reformed substrate for epitaxial growth, internally reformed substrate with multilayer film, semiconductor device, bulk semiconductor substrate, and manufacturing methods thereforAIDA HIDEO·Filed 2011·Application pending·0 cites
- 5028US2013082358A1Single crystal substrate with multilayer film, manufacturing method for single crystal substrate with multilayer film, and element manufacturing methodAIDA HIDEO·Filed 2011·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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