Assignee
HOSHINO HITOSHI
JP·3 granted patents·2 pending applications·13 citations·filing 2006–2012
Top patents by PatentIndex Score
5 records- 0184US8318518B2Light emitting device and manufacturing method thereofHOSHINO HITOSHI·Filed 2010·Granted Nov 27, 2012·6 cites·1 claims
- 0282US8497189B1Processing method for waferHOSHINO HITOSHI·Filed 2012·Granted Jul 30, 2013·4 cites·4 claims
- 0376US8518730B2Sapphire wafer dividing methodHOSHINO HITOSHI·Filed 2011·Granted Aug 27, 2013·3 cites·3 claims
- 0449US2008003708A1Method of processing sapphire substrateHOSHINO HITOSHI·Filed 2007·Application pending·0 cites
- 0547US2006255022A1Wafer laser processing method and laser beam processing machineHOSHINO HITOSHI·Filed 2006·Application pending·0 cites
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