Inventor · disambiguated record
Haeryong Kim
Also filed as: KIM HAERYONG
40 granted patents·17 pending applications·52 citations·filing 2015–2025
96Inventor score
Top patents by PatentIndex Score
57 records- 0197US10079144B2Composition for layered transition metal chalcogenide compound layer and method of forming layered transition metal chalcogenide compound layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 18, 2018·25 cites·21 claims
- 0295US10790356B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·7 cites·19 claims
- 0394US11081338B2Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 3, 2021·4 cites·20 claims
- 0492US11342414B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 0592US10217819B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 26, 2019·6 cites·16 claims
- 0688US10559660B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 11, 2020·3 cites·14 claims
- 0784US11018001B2Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·1 cites·15 claims
- 0883US12513919B2Method of manufacturing metal nitride film and electronic device including metal nitride filmSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·13 claims
- 0983US2025098186A1Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1080US11424316B2Capacitor structure and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·1 cites·10 claims
- 1179US11810946B2Integrated circuit device including capacitor with metal nitrate interfacial layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1279US11798980B2Integrated circuit device and electronic device including capacitor with interfacial layer containing metal element, other element, nitrogen, and oxygenSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1379US9922825B2Electronics device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printingSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 20, 2018·2 cites·15 claims
- 1478US12040360B2Semiconductor device including metal-2 dimensional material-semiconductor contactSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·16 claims
- 1577US12132133B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·12 claims
- 1675US12324145B2Semiconductor device with capping conductive layer on an electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
- 1775US11721781B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·18 claims
- 1875US10741389B2Method of growing two-dimensional transition metal dichalcogenide thin film and method of manufacturing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·16 claims
- 1974US12268106B2Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·11 claims
- 2074US2025204290A1Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2172US12199137B2Integrated circuit devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 2272US11004888B2Photoelectric conversion element and optical sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·0 cites·16 claims
- 2371US11424317B2Method of manufacturing metal nitride film and electronic device including metal nitride filmSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·21 claims
- 2471US2024030277A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2569US11985910B2Memristor and neuromorphic device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·21 claims
- 2668US2025240986A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2767US11728160B2Method of forming oxide film including two non-oxygen elements, method of manufacturing semiconductor device, method of forming dielectric film, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2867US2025137123A1Multi-component thin film, method of manufacturing the same, and ic device including the multi-component thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2966US11600774B2Nonvolatile memory device and operating method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·11 claims
- 3065US11804518B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 31, 2023·0 cites·18 claims
- 3164US11658024B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·0 cites·10 claims
- 3264US11367799B2Broadband multi-purpose optical device and methods of manufacturing and operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·20 claims
- 3363US2025254856A1Capacitor and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3463US2025221007A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3562US11665884B2Semiconductor device with capping conductive layer on an electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 3661US10522583B2Photoelectric conversion element and optical sensor including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·15 claims
- 3761US2024429267A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3861US2025234628A1Layer structure including silicide layer, method of manufacturing the same, and semiconductor devices and electronic devices including layer structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3960US11374171B2Memristor and neuromorphic device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·22 claims
- 4060US10867784B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 4160US10553730B2Broadband multi-purpose optical device and methods of manufacturing and operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 4, 2020·0 cites·14 claims
- 4260US2025369097A1Method for selective deposition of metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4359US11417790B2Avalanche photodetectors and image sensors including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·18 claims
- 4458US11967502B2Methods of forming material layer, semiconductor devices, and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 4558US2024234492A1Capacitor and device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4657US10460935B2Electronic device having two-dimensional (2D) material layer and method of manufacturing the electronic device by inkjet printingSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 4756US2024213306A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4856US2025006778A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4955US2024234031A1Semiconductor device and semiconductor apparatus and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5055US2024213303A1Capacitor, semiconductor device including the same and electronic apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →