Inventor · disambiguated record
Steve Ostrander
Also filed as: OSTRANDER STEVE
14 granted patents·9 citations·filing 2009–2021
85Inventor score
Top patents by PatentIndex Score
14 records- 0187US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 0276US10833051B2Precision alignment of multi-chip high density interconnectsIBM·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
- 0371US11031373B2Spacer for die-to-die communication in an integrated circuitIBM·Filed 2019·Granted Jun 8, 2021·1 cites·18 claims
- 0469US11569181B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2020·Granted Jan 31, 2023·0 cites·11 claims
- 0567US11521952B2Spacer for die-to-die communication in an integrated circuit and method for fabricating the sameIBM·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 0663US8129230B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2009·Granted Mar 6, 2012·2 cites·13 claims
- 0761US11404287B2Fixture facilitating heat sink fabricationIBM·Filed 2020·Granted Aug 2, 2022·0 cites·16 claims
- 0860US11177217B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 0960US10892233B2Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafersIBM·Filed 2018·Granted Jan 12, 2021·0 cites·7 claims
- 1051US10978313B2Fixture facilitating heat sink fabricationIBM·Filed 2018·Granted Apr 13, 2021·0 cites·15 claims
- 1150US8492910B2Underfill method and chip packageGAYNES MICHAEL A·Filed 2012·Granted Jul 23, 2013·0 cites·4 claims
- 1248US11152226B2Structure with controlled capillary coverageIBM·Filed 2019·Granted Oct 19, 2021·0 cites·24 claims
- 1348US10916507B2Multiple chip carrier for bridge assemblyIBM·Filed 2018·Granted Feb 9, 2021·0 cites·23 claims
- 1447US10985129B2Mitigating cracking within integrated circuit (IC) device carrierIBM·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →