Inventor · disambiguated record
Jae Hwan Han
Also filed as: HAN JAE-HWAN
10 granted patents·5 pending applications·37 citations·filing 2007–2015
86Inventor score
Top patents by PatentIndex Score
15 records- 0185US9019690B2Conductive resin composition, multilayer ceramic capacitor having the same, and method of manufacturing the multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 0284US9190207B2Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layerSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·5 cites·10 claims
- 0382US9368282B2Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2013·Granted Jun 14, 2016·4 cites·12 claims
- 0479US9343232B2Conductive paste composition for external electrode and multilayer ceramic electronic component including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 17, 2016·2 cites·12 claims
- 0574US9583265B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 28, 2017·2 cites·23 claims
- 0674US9082557B2Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 14, 2015·2 cites·14 claims
- 0772US8214162B2Estimation of non-equibiaxial stress using instrumented indentation techniqueHAN JAE HWAN·Filed 2007·Granted Jul 3, 2012·5 cites·21 claims
- 0862USD729250SSemiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·12 cites·1 claims
- 0952US9006875B2Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 14, 2015·0 cites·18 claims
- 1050US2014027897A1Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1145US2014063684A1Conductive paste composition for external electrode, multilayered ceramic component including the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1243US8513056B2Semiconductor memory device and method of fabricating the sameHAN JAE-HWAN·Filed 2010·Granted Aug 20, 2013·0 cites·12 claims
- 1342US2010176206A1Memory CardSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1435US2016055961A1Wire wound inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1534US2016042857A1Chip electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →