Inventor · disambiguated record
Yuichi Wada
Also filed as: WADA YUICHI
61 granted patents·15 pending applications·972 citations·filing 1978–2023
98Inventor score
Files withAPPLIED MATERIALS INC32HITACHI INT ELECTRIC INC17MITSUBISHI ELECTRIC CORP12TOKYO ELECTRON LTD3NORITSU KOKI CO LTD2
Top patents by PatentIndex Score
76 records- 0195US7464966B2Through-panel fixing device for piping memberTOKAI RUBBER IND INC·Filed 2005·Granted Dec 16, 2008·48 cites·3 claims
- 0294US6488984B1Film deposition method and apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Dec 3, 2002·231 cites·17 claims
- 0392US4451718ACircuit breakerMITSUBISHI ELECTRIC CORP·Filed 1982·Granted May 29, 1984·49 cites·12 claims
- 0491US6440282B1Sputtering reactor and method of using an unbalanced magnetronAPPLIED MATERIALS INC·Filed 2000·Granted Aug 27, 2002·75 cites·32 claims
- 0590US5267607ASubstrate processing apparatusTOKYO ELECTRON LTD·Filed 1992·Granted Dec 7, 1993·134 cites·15 claims
- 0688US5728276ATreatment apparatusTOKYO ELECTRON LTD·Filed 1995·Granted Mar 17, 1998·65 cites·18 claims
- 0787USD913979SInner shield for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Mar 23, 2021·27 cites·1 claims
- 0887US7075165B2Embedded waveguide detectorsAPPLIED MATERIAL INC·Filed 2004·Granted Jul 11, 2006·31 cites·14 claims
- 0986US9190299B2Apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·7 cites·14 claims
- 1085US9816182B2Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 14, 2017·6 cites·10 claims
- 1184US5624536AProcessing apparatus with collimator exchange deviceTEL VARIAN LIMITED·Filed 1995·Granted Apr 29, 1997·50 cites·6 claims
- 1283US12148629B2Shutter diskAPPLIED MATERIALS INC·Filed 2023·Granted Nov 19, 2024·0 cites·10 claims
- 1383US4616203AElectromagnetic contactorMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Oct 7, 1986·24 cites·6 claims
- 1481US10991617B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 27, 2021·2 cites·4 claims
- 1580US9587313B2Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 7, 2017·3 cites·14 claims
- 1679US6210539B1Method and apparatus for producing a uniform density plasma above a substrateAPPLIED MATERIALS INC·Filed 1997·Granted Apr 3, 2001·33 cites·43 claims
- 1775US7001788B2Maskless fabrication of waveguide mirrorsAPPLIED MATERIALS INC·Filed 2004·Granted Feb 21, 2006·15 cites·11 claims
- 1874US11862480B2Shutter diskAPPLIED MATERIALS INC·Filed 2021·Granted Jan 2, 2024·0 cites·9 claims
- 1974US10480069B2Storage device, vaporizer and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Nov 19, 2019·2 cites·13 claims
- 2074US5584973AProcessing apparatus with an invertible collimator and a processing method thereforTEL VARIAN LIMITED·Filed 1995·Granted Dec 17, 1996·42 cites·12 claims
- 2171USD973609SUpper shield with showerhead for a process chamberAPPLIED MATERIALS INC·Filed 2020·Granted Dec 27, 2022·5 cites·1 claims
- 2270US11610807B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 2370US11569122B2Methods and apparatus for cleaving of semiconductor substratesAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2470US7955948B2Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Jun 7, 2011·2 cites·12 claims
- 2570US4263574ASlit type current limiting fuseMITSUBISHI ELECTRIC CORP·Filed 1978·Granted Apr 21, 1981·13 cites·11 claims
- 2668US11171017B2Shutter diskAPPLIED MATERIALS INC·Filed 2020·Granted Nov 9, 2021·0 cites·12 claims
- 2768US7101725B2Solution to thermal budgetAPPLIED MATERIALS INC·Filed 2004·Granted Sep 5, 2006·9 cites·16 claims
- 2866US9365928B2Substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 14, 2016·1 cites·18 claims
- 2963US10604839B2Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 31, 2020·1 cites·8 claims
- 3063US4786770ASwitchgearMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 22, 1988·16 cites·14 claims
- 3162US2009269878A1Embedded waveguide detectorsAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3260US12476086B2Spray-coated electrostatic chuck designAPPLIED MATERIALS INC·Filed 2023·Granted Nov 18, 2025·0 cites·15 claims
- 3360US11359285B2Substrate processing apparatus, heater and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 14, 2022·0 cites·15 claims
- 3459US4628163APower switchMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Dec 9, 1986·10 cites·6 claims
- 3559US4539451ASwitchMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Sep 3, 1985·11 cites·12 claims
- 3657USD931241SLower shield for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Sep 21, 2021·5 cites·1 claims
- 3756US2007018270A1Embedded waveguide detectorsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3854US12080522B2Preclean chamber upper shield with showerheadAPPLIED MATERIALS INC·Filed 2020·Granted Sep 3, 2024·0 cites·19 claims
- 3953US11587799B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·0 cites·8 claims
- 4053US11289357B2Methods and apparatus for high voltage electrostatic chuck protectionAPPLIED MATERIALS INC·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 4153US10597780B2Substrate processing apparatus, heater and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Mar 24, 2020·0 cites·14 claims
- 4253US7702539B2Picture order receiving apparatus and a picture processing systemNORITSU KOKI CO LTD·Filed 2005·Granted Apr 20, 2010·0 cites·16 claims
- 4352US6066558AMultilevel interconnection forming method for forming a semiconductor deviceTOKYO ELECTRON LTD·Filed 1997·Granted May 23, 2000·17 cites·19 claims
- 4451US11913107B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2019·Granted Feb 27, 2024·0 cites·20 claims
- 4551US11881385B2Methods and apparatus for reducing defects in preclean chambersAPPLIED MATERIALS INC·Filed 2020·Granted Jan 23, 2024·0 cites·20 claims
- 4650US11629409B2Inline microwave batch degas chamberAPPLIED MATERIALS INC·Filed 2019·Granted Apr 18, 2023·0 cites·20 claims
- 4749US4596909AElectromagnetic contactorMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Jun 24, 1986·8 cites·7 claims
- 4848US10677830B2Methods and apparatus for detecting microwave fields in a cavityAPPLIED MATERIALS INC·Filed 2017·Granted Jun 9, 2020·0 cites·20 claims
- 4948US2011230061A1Manufacturing method of semiconductor deviceHITACHI KOSKUSAI ELECTRIC INC·Filed 2011·Application pending·0 cites
- 5046US12100577B2High conductance inner shield for process chamberAPPLIED MATERIALS INC·Filed 2019·Granted Sep 24, 2024·0 cites·20 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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