Inventor · disambiguated record
Ui-Hyoung Lee
Also filed as: LEE UI-HYOUNG
6 granted patents·5 pending applications·51 citations·filing 2004–2022
79Inventor score
Top patents by PatentIndex Score
11 records- 0194US8710657B2Semiconductor assembly and semiconductor package including a solder channelPARK JEONG-WOO·Filed 2011·Granted Apr 29, 2014·36 cites·18 claims
- 0273US8114772B2Method of manufacturing the semiconductor deviceLEE KYU-HA·Filed 2010·Granted Feb 14, 2012·6 cites·20 claims
- 0368US8183673B2Through-silicon via structures providing reduced solder spreading and methods of fabricating the sameHWANG SON-KWAN·Filed 2009·Granted May 22, 2012·5 cites·30 claims
- 0467US7807337B2Inductor for a system-on-a-chip and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 5, 2010·4 cites·17 claims
- 0550US12512367B2Method for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·17 claims
- 0641US9082680B2Joint structures having organic preservative filmsCHOI JU-IL·Filed 2012·Granted Jul 14, 2015·0 cites·16 claims
- 0741US2007059923A1Methods of fabricating damascene interconnection line in semiconductor devices and semiconductor devices fabricated using such methodsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0840US2013256876A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0938US2012292195A1Apparatus and method for electroplating for semiconductor substrateLEE UI HYOUNG·Filed 2012·Application pending·0 cites
- 1037US2005116317A1Inductor for a system-on-a-chip and method for manufacturing the sameFiled 2004·Application pending·0 cites
- 1135US2012129333A1Method for manufacturing semiconductor package and semiconductor package manufactured using the sameYIM HA-YOUNG·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →