Inventor · disambiguated record

Takasi Sugino

Also filed as: SUGINO TAKASI

2 granted patents·147 citations·filing 1995–1997

70Inventor score

Technology areasH10P

Files withLINTEC CORP2

Top patents by PatentIndex Score

2 records

0188US5705016AMethod of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheetLINTEC CORP·Filed 1995·Granted Jan 6, 1998·98 cites·2 claims
0276US5888606AMethod of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheetLINTEC CORP·Filed 1997·Granted Mar 30, 1999·49 cites·11 claims

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