Inventor · disambiguated record
Hiroshi Haji
Also filed as: HAJI HIROSHI
54 granted patents·5 pending applications·2,007 citations·filing 1991–2015
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD40PANASONIC CORP8HAJI HIROSHI3NONOMURA MASARU2ARITA KIYOSHI1
Top patents by PatentIndex Score
59 records- 0199US7767551B2Method for fabricating semiconductor chipPANASONIC CORP·Filed 2007·Granted Aug 3, 2010·183 cites·7 claims
- 0298US7927973B2Method for dividing semiconductor wafer and manufacturing method for semiconductor devicesPANASONIC CORP·Filed 2005·Granted Apr 19, 2011·116 cites·6 claims
- 0398US7629228B2Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masksPANASONIC CORP·Filed 2005·Granted Dec 8, 2009·155 cites·11 claims
- 0497US7797820B2Component mounting apparatusPANASONIC CORP·Filed 2008·Granted Sep 21, 2010·178 cites·7 claims
- 0597US6350664B1Semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 26, 2002·171 cites·22 claims
- 0696US7353596B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 8, 2008·180 cites·4 claims
- 0795US7488668B2Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regionsPANASONIC CORP·Filed 2005·Granted Feb 10, 2009·40 cites·24 claims
- 0895US7033842B2Electronic component mounting apparatus and electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Apr 25, 2006·176 cites·20 claims
- 0994US6792676B2Apparatus and method for mounting electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 21, 2004·71 cites·13 claims
- 1094US6784112B2Method for surface treatment of silicon based substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·81 cites·7 claims
- 1192US6313583B1Plasma processing apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 6, 2001·103 cites·15 claims
- 1283US8192578B2Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing methodHAJI HIROSHI·Filed 2006·Granted Jun 5, 2012·10 cites·16 claims
- 1383US6511917B2Plasma treatment apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·28 cites·11 claims
- 1483US5909633AMethod of manufacturing an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 1, 1999·72 cites·14 claims
- 1580US8614118B2Component bonding method, component laminating method and bonded component structureHAJI HIROSHI·Filed 2007·Granted Dec 24, 2013·11 cites·6 claims
- 1680US6683379B2Semiconductor device with reinforcing resin layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 27, 2004·25 cites·5 claims
- 1778US8558460B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted Oct 15, 2013·4 cites·6 claims
- 1876US7409761B2Electronic component mounting apparatus and method of mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 12, 2008·5 cites·10 claims
- 1975US6340639B1Plasma process apparatus and plasma process method for substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 22, 2002·11 cites·18 claims
- 2073US8450933B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted May 28, 2013·2 cites·2 claims
- 2173US8288284B2Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing methodARITA KIYOSHI·Filed 2010·Granted Oct 16, 2012·4 cites·12 claims
- 2272USD494988SElectric component placement machineMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 24, 2004·19 cites·1 claims
- 2371US7964449B2Method for manufacturing semiconductor chip and method for processing semiconductor waferPANASONIC CORP·Filed 2007·Granted Jun 21, 2011·3 cites·8 claims
- 2471US7222774B2Electronic component mounting apparatus and electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted May 29, 2007·4 cites·21 claims
- 2570US8158494B2Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layerHAJI HIROSHI·Filed 2009·Granted Apr 17, 2012·3 cites·3 claims
- 2670US6511895B2Semiconductor wafer turning processDISCO CORP·Filed 2001·Granted Jan 28, 2003·12 cites·4 claims
- 2770US5823416AApparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 20, 1998·32 cites·43 claims
- 2869US9433158B2Plant cultivation systemPANASONIC CORP·Filed 2012·Granted Sep 6, 2016·3 cites·4 claims
- 2969US6239036B1Apparatus and method for plasma etchingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 29, 2001·35 cites·10 claims
- 3068US6331347B2Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 18, 2001·29 cites·8 claims
- 3167US6874225B2Electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 5, 2005·10 cites·25 claims
- 3265US9775301B2Cultivation systemPANASONIC CORP·Filed 2012·Granted Oct 3, 2017·1 cites·10 claims
- 3361US7025244B2Electronic component mounting apparatus and electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 11, 2006·8 cites·24 claims
- 3461US5972163APlasma cleaning device for substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 26, 1999·26 cites·4 claims
- 3560USD493808SElectric component placement machineMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 3, 2004·12 cites·1 claims
- 3660US5647942AWire bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jul 15, 1997·27 cites·8 claims
- 3758US6093904AApparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jul 25, 2000·19 cites·14 claims
- 3857US7059043B2Method for mounting an electronic part by solder position detectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 13, 2006·5 cites·4 claims
- 3956US7137195B2Method for mounting electronic parts onto a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 21, 2006·4 cites·5 claims
- 4056US6468351B1Vacuum processing apparatus with improved maintainabilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 22, 2002·5 cites·14 claims
- 4155US5676856AElectric discharge apparatus for cleaning electrode on workpiece and method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 14, 1997·21 cites·3 claims
- 4253US6852572B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 8, 2005·5 cites·22 claims
- 4353US5767008AMethod for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 16, 1998·16 cites·6 claims
- 4453US5288008AMethod of forming inner lead bonding on a microchipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Feb 22, 1994·18 cites·5 claims
- 4552US6839960B2Method for mounting electronic parts on a boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 11, 2005·3 cites·6 claims
- 4651US7243420B2Electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 17, 2007·2 cites·10 claims
- 4750US7138034B2Electrode member used in a plasma treating apparatusKROSAKI HARIMA CORP·Filed 2002·Granted Nov 21, 2006·4 cites·8 claims
- 4849US7074720B2Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 11, 2006·2 cites·11 claims
- 4948US10069042B2Light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting systemPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·13 claims
- 5048US5846875AMethod of producing a semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 8, 1998·14 cites·13 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →