Inventor · disambiguated record
Kiyoshi Arita
Also filed as: ARITA KIYOSHI
48 granted patents·6 pending applications·1,824 citations·filing 1991–2020
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD23PANASONIC CORP16ARITA KIYOSHI5MIZUKAMI TATSUHIRO3NONOMURA MASARU2
Top patents by PatentIndex Score
54 records- 0199US7767551B2Method for fabricating semiconductor chipPANASONIC CORP·Filed 2007·Granted Aug 3, 2010·183 cites·7 claims
- 0299US7678670B2TEG removing method in manufacturing method for semiconductor chipsPANASONIC CORP·Filed 2005·Granted Mar 16, 2010·152 cites·9 claims
- 0398US7927973B2Method for dividing semiconductor wafer and manufacturing method for semiconductor devicesPANASONIC CORP·Filed 2005·Granted Apr 19, 2011·116 cites·6 claims
- 0498US7923351B2Manufacturing method of semiconductor devicesPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·121 cites·1 claims
- 0598US7906410B2Method of manufacturing semiconductor chip using laser light and plasma dicingPANASONIC CORP·Filed 2008·Granted Mar 15, 2011·192 cites·4 claims
- 0698US7767554B2Method of manufacturing semicondictor chipPANASONIC CORP·Filed 2008·Granted Aug 3, 2010·125 cites·6 claims
- 0798US7629228B2Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masksPANASONIC CORP·Filed 2005·Granted Dec 8, 2009·155 cites·11 claims
- 0895US8668836B2Plasma processing device and method of monitoring plasma discharge state in plasma processing deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Mar 11, 2014·99 cites·1 claims
- 0995US8026181B2Manufacturing method for semiconductor chipsPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·31 cites·19 claims
- 1095US7994026B2Plasma dicing apparatus and method of manufacturing semiconductor chipsPANASONIC CORP·Filed 2008·Granted Aug 9, 2011·31 cites·2 claims
- 1195US7488668B2Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regionsPANASONIC CORP·Filed 2005·Granted Feb 10, 2009·40 cites·24 claims
- 1294US11289428B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2020·Granted Mar 29, 2022·3 cites·5 claims
- 1394US6784112B2Method for surface treatment of silicon based substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·81 cites·7 claims
- 1493US7060531B2Method of cutting semiconductor wafer and protective sheet used in the cutting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 13, 2006·64 cites·4 claims
- 1592US6313583B1Plasma processing apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 6, 2001·103 cites·15 claims
- 1690US6897128B2Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 24, 2005·42 cites·19 claims
- 1789US6969669B2Method of manufacturing semiconductor device and cutting apparatus for cutting semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 29, 2005·44 cites·10 claims
- 1884US8383436B2Manufacturing method for semiconductor chips, and semiconductor chipPANASONIC CORP·Filed 2006·Granted Feb 26, 2013·9 cites·7 claims
- 1983US6511917B2Plasma treatment apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·28 cites·11 claims
- 2078US8558460B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted Oct 15, 2013·4 cites·6 claims
- 2176US8012805B2Manufacturing method for semiconductor chips, and semiconductor chipPANASONIC CORP·Filed 2006·Granted Sep 6, 2011·5 cites·21 claims
- 2276US7871901B2Manufacturing method for semiconductor chipsPANASONIC CORP·Filed 2006·Granted Jan 18, 2011·5 cites·19 claims
- 2375US6340639B1Plasma process apparatus and plasma process method for substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Jan 22, 2002·11 cites·18 claims
- 2474US7708860B2Plasma processing apparatusPANASONIC CORP·Filed 2004·Granted May 4, 2010·17 cites·13 claims
- 2573US8450933B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted May 28, 2013·2 cites·2 claims
- 2673US8288284B2Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing methodARITA KIYOSHI·Filed 2010·Granted Oct 16, 2012·4 cites·12 claims
- 2773US7056831B2Plasma processing apparatus and plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 6, 2006·13 cites·3 claims
- 2871US7964449B2Method for manufacturing semiconductor chip and method for processing semiconductor waferPANASONIC CORP·Filed 2007·Granted Jun 21, 2011·3 cites·8 claims
- 2970US8585862B2Plasma processing device and plasma discharge state monitoring deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Nov 19, 2013·4 cites·9 claims
- 3070US8158494B2Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layerHAJI HIROSHI·Filed 2009·Granted Apr 17, 2012·3 cites·3 claims
- 3170US6511895B2Semiconductor wafer turning processDISCO CORP·Filed 2001·Granted Jan 28, 2003·12 cites·4 claims
- 3269US6239036B1Apparatus and method for plasma etchingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 29, 2001·35 cites·10 claims
- 3365US7989803B2Manufacturing method for semiconductor chips and semiconductor waferPANASONIC CORP·Filed 2006·Granted Aug 2, 2011·2 cites·20 claims
- 3464US6921720B2Plasma treating apparatus and plasma treating methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 26, 2005·9 cites·9 claims
- 3562US6867146B2Plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 15, 2005·8 cites·4 claims
- 3661US8757090B2Gas shower plate for plasma processing apparatusARITA KIYOSHI·Filed 2006·Granted Jun 24, 2014·2 cites·6 claims
- 3753US6852572B2Method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 8, 2005·5 cites·22 claims
- 3853US5288008AMethod of forming inner lead bonding on a microchipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Feb 22, 1994·18 cites·5 claims
- 3950US7138034B2Electrode member used in a plasma treating apparatusKROSAKI HARIMA CORP·Filed 2002·Granted Nov 21, 2006·4 cites·8 claims
- 4049US8956499B2Plasma processing deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Feb 17, 2015·0 cites·5 claims
- 4149US7074720B2Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 11, 2006·2 cites·11 claims
- 4249US6723651B2Plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 20, 2004·2 cites·6 claims
- 4349US5586713AMethod for wire bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Dec 24, 1996·17 cites·5 claims
- 4448US8110481B2Method of segmenting semiconductor waferARITA KIYOSHI·Filed 2008·Granted Feb 7, 2012·0 cites·10 claims
- 4548US2005173065A1Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4648US2005247404A1Plasma processing apparatus and plasma processing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4745US2005279459A1Plasma treating apparatus and plasma treating methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4845US2008029197A1Surface treating apparatus using atomic hydrogenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 4942US2009266488A1Plasma Processing ApparatusARITA KIYOSHI·Filed 2006·Application pending·0 cites
- 5041US2003082914A1Semiconductor wafer processing apparatusFiled 2002·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →