Inventor · disambiguated record
Kang Wook Bong
Also filed as: BONG KANG WOOK
24 granted patents·13 pending applications·34 citations·filing 2009–2024
92Inventor score
Top patents by PatentIndex Score
37 records- 0184US10861633B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 8, 2020·2 cites·24 claims
- 0284US10763032B2Thin film-type inductorSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 1, 2020·2 cites·18 claims
- 0382US11145452B2Inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 12, 2021·2 cites·12 claims
- 0482US11094458B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 17, 2021·2 cites·8 claims
- 0579US11501915B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 15, 2022·1 cites·17 claims
- 0679US8699234B2EMI noise shield board including electromagnetic bandgap structureKIM HAN·Filed 2011·Granted Apr 15, 2014·6 cites·8 claims
- 0778US11205539B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 21, 2021·1 cites·24 claims
- 0871US8258408B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Sep 4, 2012·5 cites·7 claims
- 0971US8212150B2Electromagnetic interference noise reduction board using electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Jul 3, 2012·5 cites·8 claims
- 1070US10566130B2Coil component and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 18, 2020·0 cites·9 claims
- 1167US8227704B2Printed circuit board having electromagnetic bandgap structurePARK DAE-HYUN·Filed 2009·Granted Jul 24, 2012·4 cites·4 claims
- 1267US2025037914A1Coil componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1365US10021785B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 10, 2018·1 cites·8 claims
- 1464US10515754B2Coil component and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 24, 2019·0 cites·12 claims
- 1563US12205747B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 21, 2025·0 cites·28 claims
- 1660US11139108B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 5, 2021·0 cites·18 claims
- 1760US8314341B2Printed circuit board having electromagnetic bandgap structureKIM HAN·Filed 2009·Granted Nov 20, 2012·1 cites·6 claims
- 1860US2023178291A1Coil componentSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 1959US2025014841A1Tantalum capacitorSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 2057US12057253B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 6, 2024·0 cites·28 claims
- 2157US11217380B2Coil component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 4, 2022·0 cites·10 claims
- 2256US10796840B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·0 cites·18 claims
- 2354US8076998B2Electromagnetic bandgap structure and printed circuit boardBONG KANG-WOOK·Filed 2009·Granted Dec 13, 2011·1 cites·17 claims
- 2452US2011069470A1Electromagnetic interference noise reduction board using electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2551US8242377B2Printed circuit board having electromagnetic bandgap structureJUNG HYO-JIC·Filed 2009·Granted Aug 14, 2012·1 cites·4 claims
- 2651US2010132996A1Electromagnetic bandgap structure and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2750US2015114699A1Insulation material, printed circuit board using the same and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2849US10741321B2Thin film type inductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 11, 2020·0 cites·15 claims
- 2949US9554466B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jan 24, 2017·0 cites·20 claims
- 3045US2015156883A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3145US2015156882A1Printed circuit board, manufacturing method thereof, and semiconductor packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3245US2019198234A1InductorSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3342US8319572B2Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2009·Granted Nov 27, 2012·0 cites·20 claims
- 3442US2018350505A1Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 3534US2016100485A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3633US2015342046A1Printed circuit board, method for maufacturing the same and package on package having the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3732US2016021749A1Package board, method of manufacturing the same and stack type package using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →