Inventor · disambiguated record
Jin Heung Kim
Also filed as: KIM JIN · KIM JIN HEUNG
8 granted patents·1 pending application·107 citations·filing 1998–2018
85Inventor score
Top patents by PatentIndex Score
9 records- 0189US9962082B2Method for measuring biometric information and electronic device performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 8, 2018·20 cites·18 claims
- 0269US6039830AMethod of and apparatus for laminating a semiconductor wafer with protective tapeSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 21, 2000·39 cites·33 claims
- 0368US10704710B2Easy lock P-clampBOEING CO·Filed 2018·Granted Jul 7, 2020·2 cites·20 claims
- 0468US6193586B1Method and apparatus for grinding wafers using a grind chuck having high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 27, 2001·35 cites·11 claims
- 0565US6629876B1Apparatus for grinding wafers using a grind chuck having a high elastic modulusSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 7, 2003·11 cites·9 claims
- 0641US8895784B2Catalyst for reductive amination-reaction and uses thereofLOTTE CHEMICAL CORP·Filed 2013·Granted Nov 25, 2014·0 cites·10 claims
- 0739US10725560B2Electronic device and method controlling accessorySAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 28, 2020·0 cites·11 claims
- 0833US2019226606A1Click-in pivot hinge anchor installationBOEING CO·Filed 2018·Application pending·0 cites
- 0927US6269281B1Back lapping in-line system for semiconductor device fabricationSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 31, 2001·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →