Inventor · disambiguated record
Ji Hye Shim
Also filed as: SHIM JI H · SHIM JI-HYE
23 granted patents·26 pending applications·67 citations·filing 2006–2021
93Inventor score
Files withSAMSUNG ELECTRO MECH19SAMSUNG ELECTRONICS CO LTD11SAMSUNG DISPLAY CO LTD9KIM CHANGSUNG SEAN3SAMSUNG LED CO LTD3
Top patents by PatentIndex Score
49 records- 0190US9028978B2Compound and organic light-emitting device including the sameKIM MYEONG-SUK·Filed 2011·Granted May 12, 2015·9 cites·18 claims
- 0289US8298338B2Chemical vapor deposition apparatusKIM CHANGSUNG SEAN·Filed 2008·Granted Oct 30, 2012·21 cites·8 claims
- 0387US10615212B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 7, 2020·6 cites·21 claims
- 0485US8030667B2Nitride semiconductor light emitting diodeSAMSUNG LED CO LTD·Filed 2008·Granted Oct 4, 2011·8 cites·7 claims
- 0581US10340315B2Organic light emitting display with color filter layersSAMSUNG DISPLAY CO LTD·Filed 2016·Granted Jul 2, 2019·4 cites·19 claims
- 0681US9735387B2Organic light emitting diode displaySAMSUNG DISPLAY CO LTD·Filed 2016·Granted Aug 15, 2017·2 cites·18 claims
- 0780US9466816B2Organic light emitting diode displaySAMSUNG DISPLAY CO LTD·Filed 2015·Granted Oct 11, 2016·2 cites·18 claims
- 0879US10748828B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 18, 2020·3 cites·11 claims
- 0975US11107762B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·2 cites·20 claims
- 1075US10790255B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·2 cites·17 claims
- 1174US10938090B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·20 claims
- 1274US10505134B2Organic electroluminescence display device having stacked organic light emitting layers and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 1370US10242243B2Fingerprint sensor having printed circuit board and method of manufactureSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 26, 2019·2 cites·6 claims
- 1469US10847474B2Semiconductor package and electromagnetic interference shielding structure for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·18 claims
- 1567US11557534B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1665US9806133B2Organic light emitting diode displaySAMSUNG DISPLAY CO LTD·Filed 2016·Granted Oct 31, 2017·1 cites·18 claims
- 1756US7935970B2Nitride semiconductor light emitting diodeSAMSUNG LED CO LTD·Filed 2008·Granted May 3, 2011·0 cites·4 claims
- 1856US7851808B2Nitride semiconductor light emitting diodeSAMSUNG LED CO LTD·Filed 2008·Granted Dec 14, 2010·0 cites·3 claims
- 1956US2010024727A1Showerhead and chemical vapor deposition apparatus including the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2053US2008054271A1Nitride semiconductor light emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2152US2015014028A1Insulating film for printed circuit board and product manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2252US2013284505A1Adhesive member for manufacturing printed circuit board, printed circuit board, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2351US2010178690A1Biomolecule detection apparatus and biomolecule measurement systemSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2450US2015094403A1Surface-modified inorganic filler, method for preparing the same, epoxy resin composition and insulating film including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2550US2019345325A1Resin composition for printed circuit board and integrated circuit package, and product using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2650US2019345323A1Resin composition for printed circuit board and integrated circuit package, and product using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 2749US10626288B2Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Apr 21, 2020·0 cites·17 claims
- 2848US2018305509A1Light shielding resin compositionsSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 2948US2019345326A1Low-loss insulating resin composition and insulating film using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3048US2014174797A1Build-up film structure, circuit board manufactured using the same, and method for manufacturing circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3148US2014066544A1Insulating composition for multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3247US2014182908A1Epoxy resin composition for insulating film, insulating film, and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3346US2013337268A1Insulating epoxy resin composition, insulating film manufactured therefrom, and multilayer printed circuit board having the sameJEON KEE SU·Filed 2012·Application pending·0 cites
- 3445US10741510B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·15 claims
- 3544US9653707B2Organic light emitting diode displaySAMSUNG DISPLAY CO LTD·Filed 2015·Granted May 16, 2017·0 cites·27 claims
- 3644US2014225082A1Organic light-emitting diodeSAMSUNG DISPLAY CO LTD·Filed 2013·Application pending·0 cites
- 3743US2008042161A1Nitride semiconductor light emitting diodeSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3843US2012060887A1Asymmetric thermoelectric module and method of manufacturing the sameKIM YONG SUK·Filed 2010·Application pending·0 cites
- 3942US2014175321A1Resin composition for heat dissipation and heat dissipating substrate manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4042US2014290994A1Surface-modified inorganic filler, method of preparing the same, buildup film composition for multilayer printed wiring board, and the multilayer printed wiring board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4142US2013162064A1Laminated core and method for manufacturing the sameKIM CHANGSUNG SEAN·Filed 2012·Application pending·0 cites
- 4241US2007091455A1Electrowetting system comprising electrolyte solution with high reliabilitySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4341US2013076193A1Laminated core and fabrication method thereofKIM CHANGSUNG SEAN·Filed 2011·Application pending·0 cites
- 4440US9368743B2Method for fabricating organic light emitting deviceSAMSUNG DISPLAY CO LTD·Filed 2013·Granted Jun 14, 2016·0 cites·14 claims
- 4540US2019371737A1Electromagnetic interference shielding structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 4639US10438927B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·0 cites·20 claims
- 4739US2012286251A1Novel compound and organic light-emitting device including the samePARK SOO-JIN·Filed 2012·Application pending·0 cites
- 4835US2016155376A1Method of performing a multi-time programmable (mtp) operation and organic light-emitting diode (oled) display employing the sameSAMSUNG DISPLAY CO LTD·Filed 2015·Application pending·0 cites
- 4934US2016244605A1Resin composition and printed circuit board comprising the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →